A phosphor substrate having at least one light emitting element mounted on one surface, and includes an insulating substrate, an electrode layer disposed on one surface of the insulating substrate and bonded to the light emitting element, and a phosphor layer which is disposed on one surface of the insulating substrate and includes a phosphor in which a light emission peak wavelength, in a case where light emitted by the light emitting element is used as excitation light, is in a visible light region, in which a surface of the electrode layer facing an outer side in a thickness direction of the insulating substrate is a flat surface, and at least a part of the phosphor layer is disposed around a bonded portion of the electrode layer with the light emitting element.

The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a color appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a coloring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.

A component carrier for carrying and cooling at least one heat generating electronic component is presented. The component carrier comprising includes an outer layer structure, an electrically insulating layer arranged adjacent to the outer layer structure, and a heat conducting structure arranged adjacent to the electrically insulating layer on a side opposite to the outer layer structure. The heat conducting structure is thermally coupled to the at least one heat generating electronic component such that the outer layer structure receives thermal radiation irradiated by the heat conducting structure and transports corresponding heat away from the component carrier via convection by a heat transfer medium surrounding the component carrier.

A phosphor substrate of the present invention is a phosphor substrate having a plurality of light emitting elements mounted on one surface, and includes an insulating substrate, a first electrode group which is disposed on one surface of the insulating substrate and includes a plurality of electrodes bonded to the plurality of light emitting elements, a phosphor layer which is disposed on one surface of the insulating substrate and includes a phosphor in which a light emission peak wavelength, in a case where light emitted by light emitting element is used as excitation light, is in a visible light region, and a second electrode group which is disposed on the other surface of the insulating substrate and includes a plurality of electrodes.

A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.

The present invention provides a resin composition comprising a specific styrene polymer, a specific inorganic filler, and a curing agent, wherein the styrene polymer is a specific acid-modified styrene polymer, and the resin composition satisfies specific conditions in the form of a film having a thickness of 25 m.

A system to configure a conductive pathway and a method of forming a system of configurable conductivity pathways include a photosensitive layer that becomes conductive based on photoexcitation, and a light source layer deposited over the photosensitive layer, the light source layer selectively providing the photoexcitation to the photosensitive layer. The system further includes a controller to control the light source layer, the controller illuminating a portion of the light source layer corresponding with a user input image to photoexcite the photosensitive layer and configure the conductive pathway in the photosensitive layer according to the image.

An electronic module includes: a mount table including a first electrode mounting surface on which an electronic component is mounted; a plurality of electrode mount parts that are formed in the mount table and at which lands corresponding to a plurality of respective electrodes of the electronic component are formed on the first electrode mounting surface; a step part located between the plurality of electrode mount parts and including a predetermined step relative to the first electrode mounting surface of the mount table; and a solder withdrawing part at which an end part of a corresponding one of the lands is extended to the step part or a side surface of the mount table.

Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

A composite material for the realization of a component or a structural part, in particular for installation on-board a vehicle, adapted to integrate electrical devices and connections, includes a non-conductive polymeric matrix; a dispersed phase including at least one promoter of carbonization adapted to form carbonaceous conductive structures; and a reinforcing-fiber filler adapted to direct the distribution and orientation of the dispersed phase in the polymeric matrix.