The present disclosure is flexible and stretchable conductive articles that include a printed circuit and a stretchable substrate. The printed circuit contains an electrically conductive trace. The electrically conductive trace may be positioned on the surface of or be imbibed into the pores through the thickness of a synthetic polymer membrane. The synthetic polymer membrane is compressed in the x-y direction such that buckling of the membrane occurs in the z-direction. Additionally, the synthetic polymer membrane may be porous or non-porous. In some embodiments, the synthetic polymer membrane is microporous. The printed circuit may be discontinuously bonded to the stretchable substrate. Advantageously, the flexible, conductive articles retain conductive performance over a range of stretch. In some embodiments, the conductive articles have negligible resistance change when stretched up to 50% strain. The printed circuits may be integrated into garments, such as smart apparel or other wearable technology.

An electrical device including a plug connector. The plug connector includes a first flexible substrate having a plurality of signal contacts, the first flexible substrate extending from a terminating end to a mating end and configured to be flexible between the terminating end and mating end. A second flexible substrate extends in parallel spaced relation to the first flexible substrate to form a cavity between the first flexible substrate and second flexible substrate. The second flexible substrate having a plurality of signal contacts. The second flexible substrate extends from a terminating end to a mating end and configured to be flexible between the terminating end and mating end. The plug connector includes a rigid section disposed in the cavity at the mating end, the first flexible substrate moves in relation to the rigid section.

Disclosed are a flexible circuit board component and a display device. The flexible circuit board component includes a flexible circuit board and a foam structure. The flexible circuit board includes a first area and a second area which are arranged in a first direction and connected to each other. The foam structure is located on a side of the first area in the flexible circuit board, and includes a first foam and a second foam, and in the first direction, the second foam is located between the first foam and the second area. After the flexible circuit board component is affixed to a non-light-emitting display side of a display panel, in a direction perpendicular to an interface of the foam structure and the flexible circuit board, a height of the second foam on a side adjacent to the second area is less than a height of the first foam.

Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.

In some examples, a fluidic conductive trace based radio-frequency identification device may include a flexible substrate layer including a channel, and a trace formed of a conductive fluid that is disposed substantially within the channel. The fluidic conductive trace based radio-frequency identification device may further include a sealing layer disposed on the flexible substrate layer and the trace to seal the conductive fluid in a liquid state within the channel.

A ceramic electronic component that includes a plurality of ceramic layers which are stacked together, and an internal conductor layer disposed between two adjacent ceramic layers among the plurality of ceramic layers, and in which a ceramic layer that is adjacent to the internal conductor layer includes a plurality of pores.

Disclosed is a method of manufacturing a transmission line using a nanostructured material. The method includes locating a first insulating layer above a first nanoflon layer including nanoflon, forming a first conductive layer above the first insulating layer, forming a first pattern, which transmits and receives a signal, by etching the first conductive layer, and locating a first ground layer below the first nanoflon layer. Here, the nanoflon is a nanostructured material formed by electrospinning a liquid resin at a high voltage.

The present invention is directed to flexible conductive articles (600) that include a printed circuit (650) and a stretchable or non-stretchable substrate (610). In some embodiments, the substrate has a printed circuit on both sides. The printed circuit contains N therein a porous synthetic polymer membrane (660) and an electrically conductive trace (670) as well as a non-conducive region (640). The electrically conductive trace is imbibed or otherwise incorporated into the porous synthetic polymer membrane. In some embodiments, the synthetic polymer membrane is microporous. The printed circuit may be discontinuously bonded to the stretchable or non-stretchable substrate by adhesive dots (620). The printed circuits may be integrated into garments, such as smart apparel or other wearable technology.

The present invention is directed to flexible printed circuits for dermal applications that include a synthetic polymer membrane 702 and at least one electrically conductive trace 705. In an alternative embodiment, the electrically conductive trace is located on both sides of the microporous synthetic polymer membrane. The electrically conductive trace may be located on the surface of or be imbibed into the pores and through the thickness of a microporous synthetic polymer membrane. The flexible printed circuits may be electrically coupled to an electronic component to form a flexible printed circuit board and adhered to the skin 701 by a dermally acceptable adhesive. The flexible printed circuit or the flexible printed circuit board may be coupled to an electronic module 703 to form a hybrid flexible printed circuit board. The flexible printed circuit, flexible printed circuit board, and hybrid flexible printed circuit board achieve a balance of comfort, flexibility, and durability for on-skin use.

An electrical circuit board includes a first conductive layer and a second conductive layer. And an interlayer forming a thermal barrier is placed between the first conductive layer and the second conductive layer, wherein the thermal barrier reduces heat transfer between the first conductive layer and the second conductive layer.