A metal paste is suppled into a through hole of a ceramic substrate and heated to generate a metal porous body. A glass paste is applied on a main surface of the metal porous body while the glass paste is impregnated into open pores of the metal porous body. The glass paste is hardened by heating to form a glass layer on the main surface of the metal porous body and to make the glass paste impregnated into the open pores form glass phases. The glass layer is removed to obtain a connection substrate having a ceramic substrate and through conductors provided in through holes, respectively. The through conductor includes the metal porous body and glass phases.

A method for forming a circuit board includes forming a first dielectric layer, a first circuit layer in the first dielectric layer, a second circuit layer on the first dielectric layer, and a plurality of conductive vias in the first dielectric layer and connecting the first circuit layer to the second circuit layer; forming a second dielectric layer on the first dielectric layer and the second circuit layer; forming a plurality of openings in the second dielectric layer to expose a plurality of parts of the second circuit layer; forming a seed layer on the exposed parts of the second circuit layer and sidewalls of the openings; and forming a plurality of bonding layers on the seed layer, wherein the bonding layers and the seed layer are made of copper, and the bonding layers are porous.

The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are wetted with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.

The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are ‘wetted’ with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.

Disclosed is a flexible and stretchable electronic device based on a biocompatible film. The biocompatible film is utilized as an encapsulation layer and a substrate layer of the device; a bonding layer is provided between the encapsulation layer and a functional layer; and an adhesion layer is arranged under the substrate layer. The functional layer employs a flexible and stretchable structure. Solution-based transfer printing technology is primarily used during the preparation of such a device to achieve integration of the functional layer and the flexible substrate layer. This device retains and even enhances the flexibility and stretchability structurally. Meanwhile, the biocompatibility properties thereof, such as being waterproof and air permeable, hypoallergenic, etc., allow it to work normally on the human body surface for more than 24 hours without foreign body sensation and discomfort, and thus, skin maceration, redness or other allergic reactions due to poor biocompatibility can be avoided.

A substrate (1, 10) for electrical circuits, comprising at least one metal layer (2,3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2,3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a, 6a, 6b, 6b) to the metal layer (2,3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue (6a, 6a, 6b,6b).

A flexible substrate and a method thereof are provided. The flexible substrate includes a first flexible layer fabricated with at least one conducting path, and configured to sustain an electric power within the conducting path, a second flexible layer fabricated with one or more sensors connected in a form of a matrix, and The second flexible layer configured to generate a signal upon receiving an interaction from at least one user, a third flexible layer fabricated in-between the first flexible layer and the second flexible layer, and configured to insulate the conducting path of the first flexible layer from a matrix connection of the second flexible layer, at least one support structure operatively coupled to the first flexible layer, the second flexible layer and the third flexible layer, and configured to receive the signal generated by the second flexible layer and to provide a support.

A circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has two opposite surfaces. A metal layer is disposed on each of the opposite surfaces of the circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.

A flexible substrate and a method thereof are provided. The flexible substrate includes a first flexible layer fabricated with at least one conducting path, and configured to sustain an electric power within the conducting path, a second flexible layer fabricated with one or more sensors connected in a form of a matrix, and the second flexible layer configured to generate a signal upon receiving an interaction from at least one user, a third flexible layer fabricated in-between the first flexible layer and the second flexible layer, and configured to insulate the conducting path of the first flexible layer from a matrix connection of the second flexible layer, at least one support structure operatively coupled to the first flexible layer, the second flexible layer and the third flexible layer, and configured to receive the signal generated by the second flexible layer and to provide a support.

A wiring substrate includes a first substrate having a first surface and a second surface at an opposite side to the first surface, a first interconnection disposed on the first surface, a second interconnection disposed on the second surface, and a through interconnection electrically coupling the first interconnection and the second interconnection to each other, and penetrating the first substrate, wherein the through interconnection includes a first through interconnection coupled to the first interconnection, and a second through interconnection coupled to the second interconnection, and the first through interconnection and the second through interconnection partially overlap each other in a plan view from a thickness direction of the first substrate.