A semi-flex component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. The at least one electrically insulating layer structure forms at least part of the semi-flexible portion and includes a material having an elongation of larger than 3% and a Young modulus of less than 5 GPa.

A land (22) and a wiring pattern (25a) are formed on a component mounting surface (3A) of a circuit board (3), and the wiring pattern (25a) is covered with a solder resist layer (26). An electrode part (21c) of an aluminum electrolytic capacitor (21) is soldered to the land (22) via a solder (27). An intermediate film (24a) formed of a part of a silk pattern (24) is printed on the solder resist layer (26), and by a thermosetting adhesive (23), the aluminum electrolytic capacitor (21) is bonded to the intermediate bonding film (24a). By the intermediate bonding film (24a), the stress of the adhesive (23) at the time of thermal shrinking is relaxed.

According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, an LED mounted to the circuit board that is configured to emit light with an angular CCT deviation, a lens assembly mounted to the circuit board over the LED and configured to receive the light emitted from the LED and reduce the angular CCT deviation of the light received from the LED to make a color temperature of the light received from the LED more uniform, and an elastomer encapsulating at least part of the circuit board that is separate and distinct from the lens assembly.

A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member; and curing the first composite and the second composite.

A method for forming a flexible substrate having a via, according to the present embodiment, comprises the steps of: (a) arranging a mixture of conductive particles moving by means of a magnetic field, when a curable resin and the magnetic field are provided; (b) forming a material layer being cured and having flexibility; (c) arranging the conductive particles by providing a magnetic field; and (d) curing the curable resin and the material layer.

A multilayer board includes a flexible substrate including insulating layers stacked and a pair of through-holes penetrating the insulating layers, and an interlayer connecting conductor in an opposing region in which the pair of through-holes opposes each other in a plan view of the insulating layers viewed from a stacking direction. A cross section of the flexible substrate taken in a lateral direction passing through the pair of through-holes and the interlayer connecting conductor and the stacking direction has a U or S shape. In the cross section, a curvature radius of an inner region located between the pair of through-holes is larger than a curvature radius of an outer region adjacent to the pair of through-holes on an outer side thereof.

An integrated circuit assembly that includes a semiconductor wafer having a first coefficient of thermal expansion; an electronic circuit substrate having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion; and an elastomeric connector arranged between the semiconductor wafer and the electronic circuit substrate and that forms an operable signal communication path between the semiconductor wafer and the electronic circuit substrate.

Examples are disclosed that relate to haptic actuators. One disclosed example provides a haptic actuator including an inductive coil, a layer of a compressible material positioned adjacent to the inductive coil and transverse to an axis of the inductive coil, and a magnet positioned on the layer of compressible material such that the magnet is movable relative to the inductive coil via compression of the layer of the compressible material upon application of a control signal to the inductive coil. Another example provides an article including a textile formed at least partially from a yarn including a core and a conductor wound around the core to form an inductive coil, and a magnetic object integrated with the textile at a position transverse to a direction of a magnetic field formed by the inductive coil.

A living body-attachable electrode includes a substrate that has a first main surface and a second main surface and is made of a material having stretchability, a first electrode pair that is formed on/in the first main surface and includes two opposite electrodes, a second electrode pair that is formed on/in the first main surface and includes two opposite electrodes sandwiching the first electrode pair, and a plurality of gel electrodes that are formed on the second main surface and are in a one-to-one correspondence with the electrodes in the first and second electrode pairs. Each of the electrodes in the first and second electrode pairs and corresponding one of the gel electrodes are electrically connected to each other via a plurality of via conductors penetrating through the substrate.

A resin composition includes (A) an epoxy resin, (B) an inorganic filler, and (C) a particulate or a non-particulate elastomer, in which a specific surface area of the (B) component is 10 m.sup.2/g or more, a content of the (C) component is 35% by mass or less, and an average particle diameter of the (C) component is 0.8 m or less.