The invention discloses a composite LCP high-frequency high-speed double-sided copper foil substrate, which includes at least one LCP core layer, at least one extremely low dielectric adhesive layer, and two copper foil layers. The LCP core layer and the extremely low dielectric adhesive layer are located between the two copper foil layers. The invention has not only good electrical performance but also low roughness, stable dk/df performance in high temperature and humid environment, ultra-low water absorption, good UV laser drilling ability, low spring force suitable for high density assembly, and excellent mechanical properties. Besides, in current technology, only a thickness limited to a maximum of about 50 μm can be obtained in the coating method. In the preparation method of the invention, a substrate having a thickness of 100 μm or more can be easily obtained.

A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer device of the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

A circuit substrate comprising, in the following stacked order, a resin base material 1 having a dielectric loss tangent of 0.015 or lower, a polyaniline layer 2 comprising a substituted or unsubstituted polyaniline, and a metal layer 3, wherein the metal layer 3 has a surface roughness Rz.sub.JIS of 0.5 μm or less at the surface on the side of the polyaniline layer 2.

The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

A composite includes at least one thermoplastic polymer; and at least one PTFE-based polymer, such that the composite has a dielectric loss tangent of less than 10.sup.−3. Moreover, a method for preparing a composite includes mixing at least one thermoplastic polymer with at least one PTFE-based polymer to form a homogenous mixture; melting the mixture to form a composite material; and hot pressing the composite material to form a composite sheet.

The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.

Provided is a high oil contact angle coating comprising fluoropolymer, compositions and processes for forming the coating, and articles comprising the coating. The fluoropolymer is a crosslinkable tetrapolymer fluoropolymer produced from the copolymerization of monomers tetrafluoroethylene, fluoro(alkyl vinyl ether) or fluoro(alkyl ethylene), alkyl vinyl ether and alkenyl silane. The fluoropolymer coating has high oil contact angle and utility as coating when the fluoropolymer is in the uncrosslinked or crosslinked state.

Provided is a method for manufacturing a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin, which is a low dielectric constant thermoplastic resin, is used. This method includes providing a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil, and affixing a sheet-shaped fluororesin to the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by XPS, the content of Zn is 10 wt % or less, and the Zn/M weight ratio, the ratio of the content of Zn to the content of the transition element M, is 0.2 to 0.6.

A fluorine-containing polymer for a metal-clad laminated sheet, containing: a polymerized unit based on a fluorine-containing vinyl monomer; and a polymerized unit based on a vinyl ester monomer other than the fluorine-containing vinyl monomer. The fluorine-containing polymer contains not more than 1 mol % in total of a polymerized unit based on a monomer containing a hydroxy group and a polymerized unit based on a monomer containing a carboxy group, of all polymerized units. Also disclosed is a composition containing the fluorine-containing polymer, a curable composition containing the fluorine-containing polymer and an epoxy resin, a metal-clad laminated sheet including a metal foil and a resin layer provided on the metal foil and being formed of the curable composition, and a printed substrate including a patterned circuit formed by etching the metal foil of the metal-clad laminated sheet.

An aqueous coating material composition containing fluororesin particles (A) that can be melt-molded, further comprising silica particles (B), a non-fluorinated surfactant (C) and water (D), wherein the fluororesin particles (A) have an average particle size of 0.05 to 1000 μm, wherein the silica particles (B) have an average particle size of 0.1 to 20 μm, wherein the fluororesin particles (A) and the silica particles (B) have a blending ratio: Fluororesin particles (A)/Silica particles (B)=10/90 to 90/10 (mass ratio), and wherein a content of fluororesin particles (A) is 15 to 80 mass % relative to 100 mass % of solid content of the coating material. Also disclosed is a coated article including a coating layer formed by applying the aqueous coating material composition.