An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.

A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.

A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

A flexible circuit board includes a flexible substrate and a stiffening structure, a stiffening area is defined on a bottom surface of the flexible substrate, and the stiffening structure includes a first stiffener and a second stiffener. The first stiffener is disposed on the stiffening area of the bottom surface and the second stiffener is disposed on the first stiffener such that the first stiffener is located between the flexible substrate and the second stiffener. The flexible substrate is protected from punch damage caused by stress concentrations because a cutting line of the flexible substrate only passes through the first stiffener.

High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

The present invention relates to a production of electro-conductive traces on the surface of polymeric articles using laser excitation for the areas to be metallised, followed by activation of the laser-treated areas with a metal salt solution, the article is later rinsed in distilled water, and the activated areas are metallised in the chemical plating bath. The aims of the invention are to produce cost-effective conductive traces of the circuits for the application in 3D moulded interconnect devices, to increase the quality of the circuit traces improving the selective metallization process. An irradiation dose and scanning parameters for the surface excitation are chosen experimentally, provided that a negative static charge appears on the surface of the laser-irradiated areas. The chosen parameters ensure that any surface degradation of the polymer is avoided. The activation solution used in the method is aqueous solution consisting of one chosen salt comprising: silver (Ag), copper (Cu), nickel (Ni), cobalt (Co), zinc (Zn), chrome (Cr), tin (Sn) salt.

A method for manufacturing a flexible printed circuit board in which base sheets composed of Teflon film having heat resistance and low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal and a flexible printed circuit board manufactured by the same are disclosed. The proposed method for manufacturing a flexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.

Disclosed is a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured thereby, which minimizes a dielectric loss due to a high frequency signal and preventing a loss of the high frequency signal. The disclosed method for manufacturing the flexible printed circuit board according to an embodiment of the present disclosure includes preparing a base sheet; preparing a bonding sheet having a melting temperature lower than a melting temperature of the base sheet; forming a laminate by stacking the base sheet and the bonding sheet; and bonding by heating and pressurizing the laminate.

A method for manufacturing a flexible printed circuit board in which base sheets composed of Teflon film having heat resistance and low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal and a flexible printed circuit board manufactured by the same are disclosed. The proposed method for manufacturing a flexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.