A device includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

Protective coatings are disclosed that are configured to cover electronic components within an electronic device, while enabling electrical connections to be established with electrical contacts that are covered by the protective coatings. Such a protective coating may comprise a parylene, or a poly(p-xylylene), protective coating that has a thickness of at least 0.1 μm and at most about 2 μm. Electronic devices that include such a protective coating are also disclosed.

A circuit board includes an inner circuit substrate and an outer circuit substrate electrically connected to the inner circuit substrate. The outer circuit substrate includes an outer dielectric layer and an outer circuit layer facing the inner circuit substrate embedded in the outer dielectric layer. A portion of the outer circuit layer facing away from the inner circuit substrate protruding from the outer dielectric layer. The circuit board can increase contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the circuit board.

A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including interlayer insulating layers and conductor layers on the first surface of the substrate, and forming a second build-up structure including interlayer insulating layers and one or more conductor layers on the second surface of the substrate. The forming of the first structure includes laminating the insulating layers and metal layers on first surface side of the substrate and forming the conductor layers from all of the metal layers on the first surface side, and the forming of the second structure includes laminating the insulating layers and metal layers on second surface side of the substrate, forming the one or more conductor layers from one or more of the metal layers on the second surface side, and entirely removing the other metal layers on the second surface side.

A circuit board according to an embodiment comprises: an insulating layer including first to third regions; an outer layer circuit pattern disposed on the upper surface of the first to third regions of the insulating layer; and a solder resist including a first part disposed in the first region of the insulating layer, a second part disposed in the second region, and a third part disposed in the third region, wherein the outer layer circuit pattern has a first height, the third part of the solder resist is disposed on the upper surface of the outer layer circuit pattern to have a second height, the first region includes a first sub-region and a second sub-region, the first part includes a first sub-part disposed in the first sub-region and a second sub-part disposed in the second sub-region, the upper surface of the first sub-part is located to be higher than the upper surface of the outer layer circuit pattern and lower than the upper surface of the third part, the upper surface of the second sub-part is located to be lower than the upper surface of the outer layer circuit pattern, and the surface roughness of the third part of the solder resist is different from the surface roughness of the first part of the solder resist.

A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.

An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.

A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.

A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.