A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A′ and 95B′ within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.

Embodiments disclosed include a multilayer substrate for semiconductor packaging. The substrate may include a first layer with a first side with an xy-plane and individual locations on the first side have a first side distance below the first side xy-plane, and a second side with a second side xy-plane and individual locations on the second side may have a second side distance below the second side xy-plane; and a second layer with a first side coupled to the second side of the first layer and a second side opposite the first side of the second layer, wherein a thickness of the second layer at the individual locations on the second layer may be comprised of the first side distance plus the second side distance. Other embodiments may be described and/or claimed.

A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described.

A flexible printed wiring board according to an aspect includes an insulating base film, a conductive pattern disposed on one surface of the base film and including one or more land portions, and a solder resist layer disposed on one surface of the base film in a partial or any region excluding the one or more land portions, the solder resist layer having a CTI value of 200 V or more.

A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.

A high-frequency circuit is configured so as to include a printed circuit board and a flexible circuit board connected to the printed circuit board, wherein the printed circuit board includes: a first dielectric layer having a first surface and a second surface, a first ground conductor being formed on the first surface; a second dielectric layer having a third surface and a fourth surface, a second ground conductor being formed on the fourth surface; and first signal lines wired between the second surface and the third surface, the flexible circuit board includes: a third dielectric layer having a fifth surface and a sixth surface, a third ground conductor being formed on the fifth surface; a fourth dielectric layer having a seventh surface and an eighth surface, a fourth ground conductor being formed on the eighth surface; and second signal lines wired between the sixth surface and the seventh surface, and a connecting portion between the printed circuit board and the flexible circuit board includes: a plurality of first connecting conductors each having a first end connected to each of the first signal lines and a second end exposed from the fourth surface in a non-conductive state with the second ground conductor; and a plurality of second connecting conductors each having a first end exposed from the fifth surface in a non-conductive state with the third ground conductor and connected to the second end of each of the first connecting conductors, and a second end connected to each of the second signal lines.

Resin films, all of which are formed of the same resin material, are laminated to form a laminate. Heat and pressure are applied to the laminate to integrate the resin films into one piece; then the pressure applied to the laminate is released and the laminate is cooled. In a predetermined region of the laminate which is to constitute a bent part, one or more of the resin films are arranged on each of one side and the other side in a lamination direction of the resin films with respect to one conductor pattern; and the total thickness of the one or more resin films arranged on the one side is larger than the total thickness of the one or more resin films arranged on the other side. Consequently, the predetermined region can be bent by utilizing the difference between contraction force generated in the one or more resin films arranged on the one side and contraction force generated in the one or more resin films arranged on the other side during the cooling after the application of heat and pressure.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component embedded in the stack, and a functional film covering at least part of the component and having an inhomogeneous thickness distribution over at least part of a surface of the component.