A thin circuit board (100) and a method of manufacturing the same, the thin circuit board (100) includes: a dielectric layer (40); an inner circuit substrate (30); and a metal layer (50) formed on at least one side of the inner circuit substrate (30). The metal layer (450) is covered by the dielectric layer (40). The dielectric layer (40) includes an outermost insulating layer (11) and a bonding structure (20) sandwiched between the inner circuit substrate (30) and the metal layer (50), the metal layer (50) is wrapped by the insulating layer (11) and the bonding structure (20).

An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

The present disclosure provides a conductor arrangement for transmitting differential communication signals, the conductor arrangement includes a conductor carrier, a plurality of pairs of first conductors, two of the first conductors being electrically coupled together at their ends, and a plurality of pairs of second conductors, two of the second conductors being electrically coupled together at their ends, and wherein, as conductor bundles, in each case one of the first conductors of a pair and one of the second conductors of a pair are jointly arranged on a first side of the conductor carrier and the further first conductor of the respective pair and the further second conductor of the respective pair are arranged on a second side of the conductor carrier.

A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.

A black liquid-crystal polymer film that contains a black pigment and a liquid crystal polymer and the black liquid-crystal polymer film has a lightness of 45 or less, a dielectric loss tangent of 0.0035 or less, a minimum dielectric breakdown strength of 60 kV/mm or more, and a maximum-to-minimum ratio of in-plane thermal linear expansion coefficient in the range of 1.0 to 2.5.

A wiring substrate includes a core substrate, and a build-up part laminated on the substrate and including resin insulating layers. The insulating layers include a first insulating layer, the build-up part includes a conductor layer on the first insulating layer, a second insulating layer on the first insulating layer and covering the conductor layer, and a recess penetrating through the second insulating layer and exposing portion of the conductor layer such that the conductor layer includes component mounting region that places an electronic component in the recess and a conductor pad forming bottom surface of the recess, the insulating layers include inorganic filler such that all insulating layers or all insulating layers other than the first insulating layer include the inorganic filler and that inorganic filler content rate of the first insulating layer is lower than inorganic filler content rate of the insulating layers other than the first insulating layer.

A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

A formable transparent conductive film are described that comprise a sparse metal conductive layer, a thermoplastic polymer substrate supporting the sparse metal conductive layer, a viscoelastic polymer with a thickness from about 15 microns to about 150 microns over the sparse metal conductive layer. A layered film structure can be formed that is suitable for contouring on the surface of a three dimensional object without unacceptable increases in sheet resistance and with good optical transparency and low haze. The formable films can be placed into a frozen configuration bent 90 degrees with a radius of curvature of no more than about 5 centimeters while exhibiting a surface resistance of no more than about 500 ohms/sq. with a total transmittance with respect to visible light of at least about 80%.

A method for producing a labeled printed circuit board, as well as a labeled electric printed circuit board. In order to provide a method for producing a labeled printed circuit board that is particularly fast and energy-conserving and does not require any systems with high procurement and operating costs, initially a substrate with conductor tracks is supplied, which is then coated with a functional lacquer layer on at least one surface. A labeling of the substrate in different color shades of the functional lacquer layer is also carried out.