A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

A circuit board according to an embodiment includes: an insulating layer including a first region and a second region; a plurality of outer layer circuit patterns disposed on upper surfaces of the first region and the second region of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer and a second part disposed on the second region of the insulating layer; wherein the first part includes an upper surface having a curved surface and exposes an upper surface of an outer layer circuit pattern disposed on the first region of the insulating layer, wherein the second part covers an upper surface of an outer layer circuit pattern disposed on the second region of the insulating layer, and wherein at least a part of the upper surface of the first part is positioned lower than the upper surface of the outer layer circuit pattern.

The purpose of the present invention is to provide a wiring board on which an opaque wiring electrode is less visible. The wiring board comprises a transparent substrate, an opaque wiring electrode patterned on at least one surface of the transparent substrate, and a transparent protective layer formed on the transparent substrate and the opaque wiring electrode. The part where the opaque wiring electrode is formed has an internal reflectivity R1 of 0.1% or less, which is measured from the transparent protective layer of the wiring board, and a refractive index n1 of the transparent substrate and a refractive index n2 of the transparent protective layer satisfy the following formula (1). 0.97≤n2/n1≤1.03 (1)

A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).

A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on an upper surface of the insulating layer; a first solder resist disposed on an upper surface of the insulating layer and having a height smaller than a height of the circuit pattern; and a second solder resist disposed on an upper surface of the first solder resist and including a first portion having an upper surface lower than an upper surface of the circuit pattern and a second portion having an upper surface higher than the upper surface of the circuit pattern, wherein the circuit pattern includes: a plurality of first circuit patterns disposed on an upper surface of a first region of the insulating layer, and a plurality of second circuit patterns disposed on an upper surface of a second region of the insulating layer; wherein the first portion of the second solder resist is disposed between the plurality of first circuit patterns to have an upper surface lower than an upper surface of the first circuit pattern; and wherein the second portion of the second solder resist has an upper surface higher than an upper surface of the second circuit pattern, and is disposed to cover the plurality of second circuit patterns between the plurality of second circuit patterns.

A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

A flexible circuit board and a display panel are provided. The flexible circuit board includes a circuit board substrate layer, devices, a fluorinated-liquid solidification layer, and an insulating film. The devices are disposed on the circuit board substrate layer. Surfaces of the devices away from the circuit board substrate layer are covered with fluorinated liquid. The insulating film includes an insulating film substrate layer and a fluorine-containing adhesive layer. The fluorine-containing adhesive layer includes a resin adhesive and a fluorine-containing substance, and is in contact with the fluorinated liquid.

A printed circuit board assembly is disclosed. The printed circuit board assembly includes a printed circuit board, a sensor mounted on one side of the printed circuit board to detect a magnetic field, and a bus bar disposed in contact with another side of the printed circuit board, wherein a thickness between a region of the another side of the printed circuit board, with which the bus bar is in contact, and the one side of the printed circuit board is smaller than a thickness between a remaining region of the another side of the printed circuit board and the one side of the printed circuit board.

A flexible circuit board and a display panel are provided. The flexible circuit board includes a circuit board substrate layer, devices, a fluorinated-liquid solidification layer, and an insulating film. The devices are disposed on the circuit board substrate layer. Surfaces of the devices away from the circuit board substrate layer are covered with fluorinated liquid. The insulating film includes an insulating film substrate layer and a fluorine-containing adhesive layer. The fluorine-containing adhesive layer includes a resin adhesive and a fluorine-containing substance, and is in contact with the fluorinated liquid.