A formable transparent conductive film are described that comprise a sparse metal conductive layer, a thermoplastic polymer substrate supporting the sparse metal conductive layer, a viscoelastic polymer with a thickness from about 15 microns to about 150 microns over the sparse metal conductive layer. A layered film structure can be formed that is suitable for contouring on the surface of a three dimensional object without unacceptable increases in sheet resistance and with good optical transparency and low haze. The formable films can be placed into a frozen configuration bent 90 degrees with a radius of curvature of no more than about 5 centimeters while exhibiting a surface resistance of no more than about 500 ohms/sq. with a total transmittance with respect to visible light of at least about 80%.

A method for ink jet printing of a substrate, as well as an ink jet printed layer. To provide a method for ink jet printing of a substrate that is particularly fast and energy-conserving and does not require any systems with high procurement and operating costs, initially a substrate is supplied, which is then coated with a layer of a print medium on at least one surface. A labeling of the substrate is carried out by applying the same print medium to result in a different color shade of the printed layer.

Resin films, all of which are formed of the same resin material, are laminated to form a laminate. Heat and pressure are applied to the laminate to integrate the resin films into one piece; then the pressure applied to the laminate is released and the laminate is cooled. In a predetermined region of the laminate which is to constitute a bent part, one or more of the resin films are arranged on each of one side and the other side in a lamination direction of the resin films with respect to one conductor pattern; and the total thickness of the one or more resin films arranged on the one side is larger than the total thickness of the one or more resin films arranged on the other side. Consequently, the predetermined region can be bent by utilizing the difference between contraction force generated in the one or more resin films arranged on the one side and contraction force generated in the one or more resin films arranged on the other side during the cooling after the application of heat and pressure.

A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

A method for manufacturing a multilayer printed wiring board includes: preparing a first wiring board that includes a circuit region formed with one or more signal lines on a main surface of a first insulating substrate; preparing a second wiring board that includes an electrically conductive layer on a main surface of a second insulating substrate; disposing a spacer at a position spaced apart from an outer edge of the circuit region by a predetermined distance along at least a part of the outer edge; disposing an adhesive layer on the circuit region so that a space is provided between the adhesive layer and the spacer; and laminating the first wiring board and the second wiring board for thermocompression bonding.

An object of the present technique is to provide a transmission path that is capable of preventing deterioration of signal quality of a transmitted electric signal. The transmission path includes a reference portion, a first reflection suppressing portion, a second reflection suppressing portion, a first non-reference portion, and a second non-reference portion. The reference portion has an impedance that differs from each of the first non-reference portion and the second non-reference portion, and the first reflection suppressing portion has an impedance that is capable of suppressing a reflection coefficient of an impedance of the first transmission/reception terminal and an impedance of the first non-reference portion and has an electrical length that is equal to or shorter than an electrical length of the reference portion. The second reflection suppressing portion has an impedance that is capable of suppressing a reflection coefficient of an impedance of the second transmission/reception terminal and the impedance of the second non-reference portion and has an electrical length that is equal to or shorter than the electrical length of the reference portion.

An apparatus is provided which comprises: a woven fiber layer, a first resin layer on a first surface of the woven fiber layer, a second resin layer on a second surface of the woven fiber layer, the second surface opposite the first surface, and the first and the second resin layers comprising cured resin, a third resin layer on the first resin layer, and a fourth resin layer on the second resin layer, the third and the fourth resin layers comprising an uncured resin, and wherein the fourth resin layer has a thickness greater than a thickness of the third resin layer. Other embodiments are also disclosed and claimed.

Provided are a printed circuit board, a display device and a method of manufacturing a display device. The printed circuit board includes a base film including a first surface and a second surface, lead lines disposed on the first surface of the base film, and a first cover layer that covers at least a part of the lead lines and includes fill-in portions disposed between the lead lines. Each of the fill-in portions has a surface height less than a surface height of each of the lead lines with respect to the first surface of the base film.

Provided is a method for forming a through-hole including: forming a laminated body including a fluororesin layer having a first main surface and a second main surface, a first adhesive layer, a first reinforcing resin layer and a first conductor layer provided on the first main surface, a second adhesive layer, a second reinforcing resin layer and a second conductor layer provided on the second main surface; forming an opening in the first conductor layer and irradiating the opening with a laser beam to form a bottomed conduction hole with the second conductor layer exposed on a bottom surface of the conduction hole, wherein a thermal decomposition temperature of the second cured adhesive layer is lower than those of the first reinforcing resin layer and the second reinforcing resin layer, and a thickness of the second cured adhesive layer is 10 μm or more and 200 μm or less.

A differential circuit board includes a dielectric layer having a first and a second surface, a first conductor line with a first line-width, a second conductor line with a second line-width less than the first line-width, and a ground conductor. The dielectric layer has a first portion with a first thickness between the first and second surface and a second portion with a second thickness less than the first thickness between the first and second surfaces. The first conductor line is disposed on the first surface of the first portion. The second conductor line is disposed on the first surface of the second portion. The ground conductor is disposed on the second surface of the first portion and the second surface of the second portion, wherein the ground conductor overlaps with the first conductor line and the second conductor line. The first and second conductor lines are differential transmission lines.