A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

A semi-finished product of an electric heater device has a casing body (2) defining a housing for at least one electric heater. The casing body (2) has a first or predefined configuration, in particular a substantially planar, or plate-like, or two-dimensional configuration, and is prearranged for being folded in substantially predetermined areas (1a), which define in the casing body (2) a plurality of regions (4, 5, 6) that are at least in part relatively stiff and are suitable to be folded with respect to one another in one said folding area (1a). In this way, a second or different configuration, in particular a substantially three-dimensional configuration, can be bestowed upon the casing body (2).

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

An electrical circuit assembly comprising: a circuit component, a fabric-based component, and a fastener is disclosed along with methods for fabricating the electrical circuit assembly and for using the electrical circuit assembly. The circuit component may comprise: a substrate layer comprising an integrated circuit disposed on the substrate layer; and a first conductive linkage electrically coupled to the integrated circuit. The fabric-based component may comprise: a fabric layer comprising a first at least one conductive thread; and a second conductive linkage electrically coupled to the first at least one conductive thread. The fastener may be configured to couple the circuit component and the fabric-based component at the first conductive linkage and the second conductive linkage.

Disclosed in embodiments of the present disclosure are a flexible circuit board assembly, a display assembly and a display device. The flexible circuit board assembly includes: a first flexible circuit board, including a component part, the component part being provided with components; and a first wave absorbing layer, disposed on the component part and configured to cover the components. The display assembly includes a display module and the flexible circuit board assembly; the display module includes a module body and a second binding part, and the second binding part is configured to be bent to a back surface of the module body; and the first flexible circuit board is located on the back surface of the module body and includes a first binding part, and the first binding part is bound and connected to the second binding part of the display module.

Examples are disclosed herein that relate to electronically functional textile articles. One example provides a knitted textile article comprising a first conductive thread and a second conductive thread knit into the article in such a manner as to form a conductive junction separated by a gap. The knitted textile article further comprises a knitted surface texture feature formed at a location that defines an opening over the gap, and an electronic component connecting the gap to form a circuit with the first conductive thread and the second conductive thread.

An electronic component-embedded substrate includes a core layer, a first cavity formed in the core layer, a heat dissipating member disposed in the first cavity and having a second cavity, and an electronic component disposed in the second cavity. The heat dissipating member includes a carbon fiber reinforced polymer (CFRP).

A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.