An apparatus is provided which comprises: a woven fiber layer, a first resin layer on a first surface of the woven fiber layer, a second resin layer on a second surface of the woven fiber layer, the second surface opposite the first surface, and the first and the second resin layers comprising cured resin, a third resin layer on the first resin layer, and a fourth resin layer on the second resin layer, the third and the fourth resin layers comprising an uncured resin, and wherein the fourth resin layer has a thickness greater than a thickness of the third resin layer. Other embodiments are also disclosed and claimed.

Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.

A method of estimating a virtual contour of an insulating material is disclosed. The method includes the following steps: obtaining a first and a second images at a pair of diagonal locations of the insulating material respectively; determining a first and a second corner locations from the first and the second images respectively; selecting a first set of longitudinal end-point positions and a first set of transverse end-point positions within a range between a first specific distance and a second specific distance from the first corner location; selecting a second set of longitudinal end-point positions and a second set of transverse end-point positions within a range between the first specific distance and the second specific distance from the second corner location; and determining a first transverse axis direction, a first longitudinal axis direction, a second transverse axis direction and a second longitudinal axis direction based on these positions.

In a glass cloth made of glass filaments having a composition which is at least 50 wt % SiO.sub.2, the filaments have a diameter that is 0.5 ?m or more and less than 3.0 ?m. The glass cloth has a thickness of 15 ?m or less and a weight of from 0.3 to 10 g/m.sup.2.

A structure comprises a fabric (28) with electronic components (10, 12) mounted thereon. The fabric (28) comprises a warp and weft of fibers (30, 32), each of the warp and weft comprising a combination of electrically conducting fibers (30) and electrically non-conducting fibers (32). The electronic components (10, 12) are connected to at least one electrically conducting fiber (30). The electronic components, in a preferred embodiment comprise a plurality of end of line elements (10) and a corresponding plurality of groups of line elements (12), each group of line elements (12) connected to an end of line element (10).

A structure comprises a fabric with electronic components mounted thereon. The fabric comprises a warp and weft of fibres, each of the warp and weft comprising a combination of electrically conducting fibres and electrically non-conducting fibres. The electronic components are connected to at least one electrically conducting fibre. The electronic components, in a preferred embodiment comprise a plurality of end of line elements and a corresponding plurality of groups of line elements, each group of line elements connected to an end of line element.

According to an aspect of the present inventive concept there is provided a system comprising: a conductive textile including conductive fibers, an electronic circuit unit arranged on a first main surface of the conductive textile and including circuitry and a carrier supporting the circuitry, the carrier having a first main surface and a second main surface facing the first main surface of the textile and including a through-hole extending from the first main surface to the second main surface, a conductive pin including an leg segment arranged at least partly in the through-hole, and a grip segment arranged to grip about at least one fiber of the conductive textile. There is also provided a method for mounting an electronic circuit unit on a conductive textile.

A method of manufacturing a printed circuit board (PCB) includes determining a weft direction of the PCB, and defining a routing design of differential pairs. The routing design is designed to have a fixed region in the weft direction. The method further includes manufacturing the PCB according to the routing design.

Printed wiring board manufacturing method, and printed wiring board. The method includes preparing sheet material including cloth-like material woven of reinforced fiber with a 90 degree between warp thread and a weft thread; arranging the sheet material on a cutting-out apparatus so that the sheet material is tilted 5 to 30 degrees with respect to threads configuring the cloth-like material and cutting a portion to cross the cloth-like-material configuration threads aligned on a cutting blade at 5 to 30 degrees; cutting the sheet material from the tilted sheet material with the cut portion crossing the cloth-like-material configuration threads aligned on the cutting blade to form the sheet material with a circumferential edge of the sheet material crossing the cloth-like material configuration threads at 5 to 30 degrees; creating a mother laminate configured with the sheet material as an inner-layer board or an insulating board; and providing a conductor pattern on a metal layer of the mother laminate along a circumferential edge portion of the mother laminate.

Aspects of the disclosure are directed to apparatuses and methods involving an electrical connector and methods thereof. As may be consistent with one or more embodiments, an interposer includes respective barrier layers having barrier material that is coplanar with, and laterally surrounds, traces having connected via pads. Vias connect pads of stacked pairs of the traces in different ones of the barrier layers. The traces vary in width along their respective lengths. The barrier material is offset from each trace by a continuous gap having a length extending around the trace, with the gaps extending around each stacked pair being offset from one another along the majority of their respective lengths.