A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×10.sup.4 or more and less than 45×10.sup.4. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.

A method for wiring differential signal lines and a PCB are disclosed. The wiring method includes: providing a rectangle-shaped glass fiber fabric formed of glass fibers which are woven and interlaced with each other and an adhesive filled therebetween; determining a wiring direction and obtaining a glass fiber bundle number of the glass fiber fabric in the wiring direction; equally dividing the glass fiber fabric into glass fiber units, and obtaining a width of each glass fiber unit according to a size of the glass fiber fabric in a direction perpendicular to the wiring direction and the number of the glass fiber units; determining a line distance and line widths of the differential signal lines; and according to the line distance and the line widths, forming the differential signal lines on a metal layer along the wiring direction to make the differential signal lines meet predetermined requirements.

A wiring board includes a first electrically-conductive layer; and a first resin layer covering the first electrically-conductive layer, the first resin layer including a resin portion and inorganic insulating particles dispersed in the resin portion. The first resin layer has a first layer region which is in contact with one main surface and side surfaces of the first electrically-conductive layer, and a second layer region which is located on a side of the first layer region which side is opposite to the first electrically-conductive layer. The inorganic insulating particles include a plurality of first inorganic insulating particles contained in the first layer region, and a plurality of second inorganic insulating particles contained in the second layer region. A content rate of the first inorganic insulating particles in the first layer region is lower than a content rate of the second inorganic insulating particles in the second layer region.

A printed wiring board includes first, second, and third wiring layers, first and second insulating members, and first and second vias. The first wiring layer includes a recognition mark and a first wiring on a first surface. The second wiring layer includes a first pad and a second wiring. The third wiring layer includes a third wiring. The first via penetrates the first insulating member and electrically connects the recognition mark to the first pad. The second via penetrates the second insulating member and electrically connects the first pad to the third wiring. The first pad and the first and second vias are in a region within an outer perimeter of the recognition mark when viewed from a direction orthogonal to the first surface.

Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.

An apparatus includes a printed circuit board (PCB) that includes a woven glass laminate layer. The woven glass laminate layer includes a plurality of glass bundles woven together, where a marker structure including at least one marker is defined within the woven glass laminate layer. A security chip is coupled with the PCB and includes memory that stores an authentication identifier of the PCB, where the authentication ID includes a representation of the marker structure.

An electrical circuit assembly comprising: a circuit component, a fabric-based component, and a fastener is disclosed along with methods for fabricating the electrical circuit assembly and for using the electrical circuit assembly. The circuit component may comprise: a substrate layer comprising an integrated circuit disposed on the substrate layer; and a first conductive linkage electrically coupled to the integrated circuit. The fabric-based component may comprise: a fabric layer comprising a first at least one conductive thread; and a second conductive linkage electrically coupled to the first at least one conductive thread. The fastener may be configured to couple the circuit component and the fabric-based component at the first conductive linkage and the second conductive linkage.

A printed circuit board includes a first insulating layer; a first wiring layer buried in the first insulating layer, exposed to one surface of the first insulating layer, and including a plurality of first wiring patterns; a second wiring layer including a plurality of second wiring patterns spaced apart from the plurality of first wiring patterns on the one surface of the first insulating layer; and a second insulating layer disposed on the one surface of the first insulating layer and covering the plurality of second wiring layers. At least a portion of the plurality of second wiring patterns on the one surface of the first insulating layer is disposed in regions between adjacent first wiring patterns among the plurality of first wiring patterns.

A resin composition contains an epoxy compound and a curing agent. The epoxy compound includes a phosphorus-containing epoxy compound having a phosphorus atom in its molecule. The curing agent includes a phosphorus-containing acid anhydride having a phosphorus atom and an acid anhydride group in its molecule.