A composite includes at least one thermoplastic polymer; and at least one PTFE-based polymer, such that the composite has a dielectric loss tangent of less than 10.sup.−3. Moreover, a method for preparing a composite includes mixing at least one thermoplastic polymer with at least one PTFE-based polymer to form a homogenous mixture; melting the mixture to form a composite material; and hot pressing the composite material to form a composite sheet.

A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.

A prepreg includes: a resin composition or a semi-cured product thereof; and a fibrous base material, wherein the resin composition contains a polymer having a structural unit expressed by the formula (1) in a molecule, and a curing agent each at a predetermined content rate. A cured product of the resin composition has a Dk of 2.6 to 3.8, and the fibrous base material includes a glass cloth having a Dk of 4.7 or less and a Df of 0.0033 or less. A cured product of the prepreg has a Dk of 2.7 to 3.8, and a Df of 0.002 or less.

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In the formula (1), Z represents an arylene group, R.sub.1 to R.sub.3 each independently represents a hydrogen atom or an alkyl group, and R.sub.4 to R.sub.6 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

This disclosure relates to a curable composition that includes at least first, second, and third polymers. The first polymer includes a first monomer unit and a second monomer unit different from the first monomer unit, in which the first monomer unit has the structure of formula (I) defined in the Specification and the second monomer unit has the structure of formula (II) defined in the Specification. The second polymer includes at least about 60 wt % of a styrene monomer unit; and the third polymer includes at most about 60 wt % of a styrene monomer unit. This disclosure also relates to using the composition to form a free-standing film, a laminate, a prepreg, and/or a printed circuit board.

A package substrate and a manufacturing method thereof, the method including: forming a package substrate by a first dielectric layer formed by weaving at least fiberglass of a first width and a second dielectric layer formed by weaving at least fiberglass of a second width. The second width is different from the first width, and the weaving direction of the fiberglass in the first dielectric layer is 90° relative to the weaving direction of the fiberglass in the second dielectric layer.

A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.

The present disclosure relates to a glass cloth, prepreg, and printed circuit board.

There is provided a glass cloth including woven glass yarns each containing a plurality of filaments, wherein a bulk dissipation factor of a glass in the glass yarns is 0.0010 or less, a tensile strength of warp yarns per thickness of the glass cloth as represented by the following formula (A) is in the range of 0.50 to 6.0:

warp direction tensile strength (N/25 mm) of the glass cloth/thickness of the glass cloth (m)(A) a coefficient of variation of the warp direction tensile strength of the glass cloth is in the range of 15% or less, and a dissipation factor of the glass cloth at 10 GHz is in the range of greater than 0 and 0.0010 or less.