A prepreg, a laminated board, and a printed circuit board thereof are provided. The prepreg includes a halogen-free epoxy resin composition and a partially cured non-woven reinforcing material impregnated therein. The non-woven reinforcing material has a dielectric strength of 1.5 to 4.8 and a loss factor that is less than 0.003 at 10 GHz, and the halogen-free epoxy resin composition includes: (a) 100 parts by weight of a halogen-free naphthalene type epoxy resin, (b) 10 to 25 parts by weight of a DOPO modifying curing agent, (c) 25 to 45 parts by weight of a cyanate resin, (d) 35 to 60 parts by weight of bismaleimide, (e) 45 to 65 parts by weight of a non-DOPO flame retardant, and (f) 0.5 to 15 parts by weight of a curing accelerator.

A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

A prepreg is a blend of a fiber reinforcement, a matrix resin and a filler. Based on 100 parts by mass of the prepreg, the fiber reinforcement is 20-60 parts by mass, the matrix resin is 20-65 parts by mass, and the filler is 10-40 parts by mass. The filler is a flame-retardant organic microsphere or a blend of the flame-retardant organic microsphere and an inorganic filler, and the particle size of the filler is preferably 0.1 microns to 15 microns. A copper-clad laminate and a printed circuit board are also disclosed. In various embodiments, the stability of material properties of the prepreg can be improved, the prepreg manufacturing process is simplified, the prepreg production efficiency is improved. Due to the high production efficiency of the prepreg, the manufacturing cost of the prepreg, the copper-clad laminate and the printed circuit board can be reduced.

A copper-clad laminate includes an insulating substrate and a copper foil layer covering a surface of the insulating substrate. The insulating substrate includes at least one first insulating layer, and the first insulating layer is a blend of a surface fiber felt made of fibers and resin or a blend of a non-woven fabric-reinforced composite material and resin, and the copper foil layer is attached to an outer surface of the first insulating layer. The present disclosure also provides a printed circuit board, which is made from the copper-clad laminate of the present disclosure. The present disclosure also provides a method for manufacturing the printed circuit board. Compared with the related arts, the copper-clad laminate and the printed circuit board of the present disclosure have improved dielectric properties.

The present disclosure provides a polymer matrix composite, and a laminate, a prepreg and a printed circuit board using the same. The polymer matrix composite includes a polymeric resin and a non-woven inorganic material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003. The printed circuit board uses the laminate including the polymer matrix as a core layer which is sandwiched between at least two outer layers.

Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.

A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.

A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20 C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.

A wiring board includes: a support body including a plurality of openings passing from one surface to one other surface; and a conductor supported by the support body. The conductor includes: a first outer layer formed on one side of the support body; a second outer layer formed on the other surface of the support body and that has substantially the same shape as the first outer layer; and an inner layer formed inside the support body and that connects the first outer layer and the second outer layer. The inner layer has a frame shape along an outer edge of the first outer layer and along an outer edge of the second outer layer.

A circuit board for a non-combustion flavor inhaler includes a substrate and an electrically conductive ink pattern printed on the substrate. The substrate includes paper. A percentage weight loss of the paper from room temperature to 290 C. is less than 20% of a percentage weight loss of the paper from room temperature to 900 C. under a condition that allows air to flow at a flow rate of 100 mL/min while elevating a temperature of the air at a speed of 10 C./min.