An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

There is provided a heat dissipating substrate including: a base substrate having a first through hole formed therein; a first substrate disposed on an upper end portion of the base substrate and including a second through hole having a diameter smaller than that of the first through hole; and a heat dissipating pad disposed on an upper end portion of the second through hole. In addition, a flow phenomenon of a thermal conduction member (lead) may be reduced using the thermal conduction member by forming a second through hole smaller than a first through hole.

A thermally-efficient electrical assembly comprising: an electrically-conductive layer; a heat sink layer; an electrically-insulating interconnecting layer interposed between the electrically-conductive layer and heat sink layer; an electrical component in electrical communication with the electrically-conductive layer; and a metallic thermal bridge in thermal communication with the electrical component and in direct contact with the heat sink layer, thereby bypassing the electrically-insulating layer.

An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa.Math.s or less, and the melting point T1 and the activation temperature T3 satisfy T1T3<50 C.

In an integrated circuit package that houses radio-frequency (RF) circuits or components using wafer-level packaging (WLP), an RF-signal transmission structure includes a signal-carrying conductive line positioned between grounded conductive lines to avoid undesirable coupling between the signal-carrying conductive line and other RF circuits or components in the same package.

An electronic device may include: a flexible printed circuit board having a flexible region and a support region and configured to be deformable in the flexible region; an antenna module facing the support region of the flexible printed circuit board; a solder ball for connecting the antenna module to the flexible printed circuit board; an underfill resin filled between the flexible printed circuit board and the antenna module in a liquid state and then solidified; and a solder wall for connecting the antenna module to the flexible printed circuit board and placed between the solder ball and the flexible region to block the flow of the underfill from the support region toward the flexible region before the underfill resin is solidified, and the solder wall has a width equal to or greater than the width of the flexible region. Various other embodiments are possible.

A method for manufacturing a conductive via-containing substrate is provided, the method including: step a of preparing a substrate provided with a hole and providing a metal paste part containing metal particles and a volatile solvent to cover at least a surface surrounding the hole of the substrate while an inside of the hole is filled with the metal paste part; step b of heating the metal paste part to remove a part of the volatile solvent; step c of removing a part of the metal paste part after heating to expose the surface to form a conductive via precursor in the hole, the conductive via precursor containing the metal particles and a residue of the volatile solvent and having a planarized exposed surface; and step d of firing the conductive via precursor.

An electronic device may include: a flexible printed circuit board having a flexible region and a support region and configured to be deformable in the flexible region; an antenna module facing the support region of the flexible printed circuit board; a solder ball for connecting the antenna module to the flexible printed circuit board; an underfill resin filled between the flexible printed circuit board and the antenna module in a liquid state and then solidified; and a solder wall for connecting the antenna module to the flexible printed circuit board and placed between the solder ball and the flexible region to block the flow of the underfill from the support region toward the flexible region before the underfill resin is solidified, and the solder wall has a width equal to or greater than the width of the flexible region. Various other embodiments are possible.