A power control module includes a power device having a first side and a second side opposite from the first. The power control module includes a printed wiring board (PWB) spaced apart from the first side of the power device. The PWB is electrically connected to the power device. A heat sink plate is soldered to a second side of the transistor for heat dissipation from the transistor. The PWB and/or the heat sink plate includes an access hole defined therein to allow for access to the transistor during assembly. A method of assembling a power control module includes soldering at least one lead of a power device to a printed wiring board (PWB), pushing the power device toward a heat sink plate, and soldering the power device to the heat sink plate.

A module component includes a substrate; first, second, third and fourth main electrodes on or in a principal surface of the substrate; a sub-electrode located between two of the four main electrodes and connected to one of the four main electrodes by a solder; a first mount component mounted to the first and second main electrodes; and a second mount component mounted to the third and fourth main electrodes; wherein an area of the sub-electrode is smaller than an area of each of the first, second, third and fourth main electrodes.

The present disclosure relates to a multilayer ceramic substrate preparation method. The multilayer ceramic substrate preparation method according to the present disclosure includes firing a plurality of ceramic green sheets, to create a plurality of ceramic thin films; forming a via hall in each of the plurality of ceramic thin films; filling the via hall of the plurality of ceramic thin films with conductive paste, and heat treating the via hall filled with the conductive paste, to form a via electrode; printing a pattern on a cross section of each of the plurality of ceramic thin films, and heat treating the printed pattern, to form an inner electrode; applying a bonding agent on the cross section of each of the ceramic thin films excluding an uppermost ceramic thin film of the plurality of ceramic thin films; aligning and laminating each of the plurality of ceramic thin films such that each of the plurality of ceramic thin films is electrically connected through the via electrode and the inner electrode; and firing or heat treating the laminated plurality of ceramic thin films.

A cooling package in a power module (401,503) comprises a first side for placing one or more semiconductor components (406,501); one or more holes for placing one or more magnetic components (305); and a second side with one or more connection parts. Therefore, all components of a power module (401,503) which need to dissipate the heat have two thermal dissipation paths, therefore the heat inside the module can be greatly reduced.

A pin assembly is provided for a plated via of a circuit board. The pin assembly includes a pin sized for insertion into the plated via, and a plurality of expandable elements affixed to the pin. A conductive coating is disposed over the pin and over the plurality of expandable elements. With the pin assembly inserted into the plated via, one or more expandable elements of the plurality of expandable elements can be expanded within the plated via to enhance contact of the pin assembly to a wall of the plated via.

A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.

The present invention relates generally to electric circuit testing, building, or implementing using a breadboard-style printed circuit board (PCB). Aspects of the present invention include eliminating the need to use hookup wires when building and testing electric circuits on PCBs. In one or more embodiments, a PCB system having rows and columns of signal tie points connected in a breadboard layout and using an embedded wire and a solder bridge to form partial connections between signal tie points may be built. In one or more embodiments, an embedded wire and solder bridge is capable of connecting a column of signal tie points, and/or an embedded wire and solder bridge is capable of connecting a power rail to a signal tie point. Thus, a circuit may be implemented and tested by applying a small amount of solder to the solder bridge without the need for hookup wire.

According to an aspect of the present inventive concept there is provided a system comprising: a conductive textile including conductive fibers, an electronic circuit unit arranged on a first main surface of the conductive textile and including circuitry and a carrier supporting the circuitry, the carrier having a first main surface and a second main surface facing the first main surface of the textile and including a through-hole extending from the first main surface to the second main surface, a conductive pin including an leg segment arranged at least partly in the through-hole, and a grip segment arranged to grip about at least one fiber of the conductive textile. There is also provided a method for mounting an electronic circuit unit on a conductive textile.

A laminated substrate includes: a first substrate; a second substrate having a through-hole; a third substrate; a first adhesive layer bonding a rear surface of the first substrate and a front surface of the second substrate; a second adhesive layer bonding a rear surface of the second substrate and a front surface of the third substrate; a first post penetrating through the first adhesive layer, electrically connecting the first substrate to the second substrate, and made of an alloy of a high melting point metal and a low melting point metal; a second post penetrating through the second adhesive layer, electrically connecting the second substrate to the third substrate, and made of an alloy of the high melting point metal and the low melting point metal; and an electronic component fixed to the front surface of the third substrate and disposed in the through-hole of the second substrate.

A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.