The present disclosure relates to a method for the process-reliable soldering of a chip package onto a printed circuit board for the process-reliable soldering of a chip package. The printed circuit board has a metallic cooling surface, a plurality of metallic contact surfaces surrounding the cooling surface, and, on a side opposite the cooling surface, a rear metallic mating surface, the mating surface being connected to the cooling surface by open vias, and lanes of solder resist being arranged on the cooling surface, which lanes both divide the cooling surface into a plurality of partial surfaces and enclose the vias.

An apparatus includes a substrate having one or more vias formed therein. At least one of the vias has at least one liner disposed on at least one sidewall thereof. The apparatus also includes at least one interconnect formed through the at least one via. The one or more interconnects comprise a solder material filled using injection molded soldering.

A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.

A module includes a substrate, a first wiring, a second wiring, and an interlayer connection section. The substrate includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and an inner surface of a hole extending between the first surface and the second surface. The first wiring is provided on the first surface. The second wiring is provided on the second surface. The interlayer connection section includes a first conductor provided on the inner edge, connected to the first wiring and the second wiring, thinner than the first wiring, and thinner than the second wiring, and a second conductor disposed in the hole and electrically connected to the first conductor.

According to an aspect of the present inventive concept there is provided a system comprising: a conductive textile including conductive fibers, an electronic circuit unit arranged on a first main surface of the conductive textile and including circuitry and a carrier supporting the circuitry, the carrier having a first main surface and a second main surface facing the first main surface of the textile and including a through-hole extending from the first main surface to the second main surface, a conductive pin including an leg segment arranged at least partly in the through-hole, and a grip segment arranged to grip about at least one fiber of the conductive textile.

There is also provided a method for mounting an electronic circuit unit on a conductive textile.

A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

A printed circuit board (1) comprising an insulating layer (2) and a conducting layer (3) arranged on the insulating layer (2) and structured into a contact surface (4) for an electronic component (11) which is to be populated on the printed circuit board (1) has, in the area of the contact surface (4), at least one channel (8) that passes through the contact surface (4) and the insulating layer (2) and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer (2) and a conducting layer (3) connected with the insulating layer (2); producing at least one channel (8) passing through the conducting layer (2) and the insulating layer (3); lining the channel (8) with thermally conductive material; structuring the conducting layer (3) into a contact surface (4) for an electronic component (11) to be populated on the printed circuit board; preparing a solder deposit (9) at least minimally overlapping with the contact surface (4); setting down the electronic component (11); melting the solder, and cooling.

A method for forming a functional part in a minute space includes the steps of: filling a minute space with a dispersion functional material in which a thermally-meltable functional powder is dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium present in the minute space; and heating the functional powder and hardening it under pressure.

Tin or tin alloy plating liquid with a sufficient plated deposit can be formed in the opening without causing burns on the plated film surface or abnormal deposits, and which has a good via filling effect. When a specific , -unsaturated carbonyl compound is added into the tin or tin alloy plating liquid, the plating liquid with good via filling performance can be obtained, and the deposit which is substantially free of voids and burns or abnormal deposits on the deposit surface are reduced.

The steps of forming a multi-layer flexible printed circuit cable (flex circuit) with an electrical interconnection between independent conductive layers. In accordance with various embodiments, a partial aperture is formed in the flex circuit that extends through a first conductive layer and an intervening insulative layer to an underlying surface of a second conductive layer that spans the partial aperture. A solder material is reflowed within the partial aperture to electrically interconnect the first and second conductive layers.