An implantable device for the electrical and/or pharmaceutical stimulation of the central nervous system, especially the spinal cord, is suggested. The device comprises a conformable substrate which is primarily composed of a flexible and stretchable polymer, and a plurality of flexible electrodes and conductive leads embedded in the conformable substrate. Not only the substrate, but also the leads are stretchable. The substrate may consist of PDMS, and the leads may consist of a conductive PDMS, in particular, PDMS with an electrically conductive filler material, and may optionally be metal-coated. The device defines a multi-electrode array which may be employed for neurostimulation in the epidural or subdural space of an animal or human.

A microelectronic substrate may be fabricated having a substrate core with at least one plated through hole extending therethrough, wherein the plated through hole includes a fluorescent conductive fill material which can be utilized to detect defects during the fabrication process. In one embodiment, the microelectronic substrate may be fabricated by forming a substrate core, forming a hole to extend from a first surface to an opposing second surface of the substrate core, forming a conductive material layer on a sidewall(s) of the substrate core hole, disposing a fluorescent conductive fill material to abut the conductive material layer and fill the remaining substrate core hole, illuminating an exposed portion of the fluorescent conductive fill material, and detecting anomalies in the light fluoresced by the exposed portion of the fluorescent conductive fill material.

A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer along a direction perpendicular to the circuit board and a projection of the second conductive wiring layer totally cover each other.

A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

A transparent electrode includes: a substrate; and a conductive metal layer on the substrate. The conductive metal layer has a thin metal wire and a plating layer. The plating layer covers the thin metal wire. The transparent electrode further includes a transparent conductive layer on a surface of the substrate on a side on which the thin metal wire is formed. The transparent conductive layer covers the substrate and the conductive metal layer. The thin metal wire is formed using a metal nanoparticle ink or a metal complex ink.

A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.

Methods for obtaining composites of polyaniline and reduced graphene oxide are disclosed. The methods include dispersing graphene oxide in an acid aqueous solution containing an anionic emulsifying agent to obtain a dispersion of the graphene oxide, dissolving an aniline oligomer in an organic solvent to obtain a solution of the oligomer, and mixing the solution of the oligomer with the dispersion of graphene oxide to obtain a composite of polyaniline and reduced graphene oxide. The methods may also include recovering a precipitate of the polyaniline/reduced graphene oxide composite, and dissolving the precipitate in an organic solvent to form a conductive ink or an ink for electronic devices.

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

A composition comprising i) at least one polythiophene selected from the group consisting ofa polythiophene comprising monomer units of structure (I) in which * indicates the bond to the neighboring monomer units, x, z represent O or S, R.sup.1-R.sup.4 independently from each other represent a hydrogen atom or an organic residue R, with the proviso that at least one of residues R.sup.1 to R.sup.4 represents an organic residue R; a polythiophene which is characterized by its compatibility in PGME (1-methoxypropan-2-ol), demonstrated by an RF-value of at least 0.8; iii) at least one ethylenically unsaturated compound; iv) at least one organic solvent; v) at least one radical initiator. The present invention also relates to a process for preparing a layer structure, to a layer structure obtainable by this process, to a layer structure, to an electronic component and to the use of composition according to the present invention.