A method for manufacturing an electromagnetic shielding film comprising providing an insulating layer, wherein the insulating layer is metallized to obtain a silver layer; and painting a conductive adhesive on a surface of the silver layer to form a conductive adhesive layer. The conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%.

A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.

A wiring circuit board includes an insulating base layer, a conductive layer disposed on a one-side surface in a thickness direction of the insulating base layer, a cover insulating layer disposed on the one-side surface in the thickness direction of the insulating base layer to cover the conductive layer, and a shield layer disposed on the other-side surface in the thickness direction of the insulating base layer and both side surfaces in the width direction of the insulating base layer and on a one-side surface in the thickness direction of the cover insulating layer and both side surfaces in the width direction of the cover insulating layer. At least one of the insulating base layer and the cover insulating layer has a porous resin layer.

A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick.

The disclosure provides a display panel and a displaying device. The display panel comprises a bonding area and an active area; a flexible printed circuit board, the flexible printed circuit board being arranged on a side, away from the active area, of the bonding area, and comprising a display signal line which extends in a first direction and is electrically connected to the bonding area; and a touch driving line and a signal receiving line, the touch driving line and the signal receiving line being connected to the flexible printed circuit board from the active area via the bonding area, and the display signal line not overlapping with the touch driving line or the signal receiving line.

A circuit board for a control device for a vehicle includes a clamp edge for clamping on a cover for covering circuit board, the clamp edge being formed by an electrically conductive layer that is situated on an upper side of the circuit board. The circuit board has a plurality of solder bumps for shielding an electromagnetic radiation, the solder bumps being arranged in a row in clamp edge, and each of solder bumps being insulated from the electrically conductive layer by a ring of solder resist.

A module includes a printed circuit board (PCB) having a substrate, component pads on a top surface of the substrate, and contact pads formed on a bottom surface of the substrate. The module further includes a mold compound disposed over the PCB; an external shield disposed over a top surface of the mold compound and on side surfaces of the mold compound and the PCB, where the external shield is configured to provide shielding of at least one component connected to at least one component pad from electromagnetic radiation; and a back-spill barrier formed on the bottom of the substrate. The back-spill barrier surrounds the contact pads, and is configured to prevent the external shield from making contact with the contact pads.

An integrated circuit structure includes a substrate, a photosensitive molding on a first side of the substrate, a via formed in the molding, and a conformable metallic layer deposited over the first side of the substrate and in the via. A through via may be formed through the substrate aligned with the via in the molding with an electrically conductive liner deposited in the through via in electrical contact with the conformable metallic layer. The integrated circuit structure may further include a connector element such as a solder ball on an end of the through via on a second side of the substrate opposite the first side. The integrated circuit structure may further include a die on the first side of the substrate in electrical contact with another through via or with a redistribution layer.

An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.

An imager assembly for a vehicle is disclosed. The assembly comprises an optic lens comprising a proximal end portion, a distal end portion, and a longitudinal axis extending there between. An imager circuit is in conductive connection with an imager connector. The imager connector is configured to communicatively connect the imager circuit to the vehicle. A lens holder of a conductive material forms a shielded cavity configured to receive the proximal end portion of the optic lens and the imager circuit. The lens holder is configured to align the imager with the longitudinal axis of the optic lens.