The disclosed hybrid shielding structure may include a printed circuit board (PCB) that is to be overmolded with at least a portion of molding compound. The PCB may include various electronic components disposed thereon. The hybrid shielding structure may also include conductive trenches and conductive fences that are disposed on the PCB. The conductive trenches and the conductive fences may provide an electromagnetic shield for at least a portion of the electronic components of the PCB. The hybrid shielding structure may further include a conformal shielding and a PCB ground flood and ground layers. Various other systems, electronic devices, apparatuses, and methods of manufacturing are also disclosed.

A battery module includes a housing, a plurality of battery cells disposed in the housing, and a printed circuit board (PCB) assembly disposed in the housing. The PCB assembly includes a PCB and a shunt disposed across a first surface of the PCB. A second surface of the shunt directly contacts the first surface of the PCB, and the shunt is electrically coupled between the battery cells and a terminal of the battery module.

Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.

A display module includes a display panel, a flexible circuit board, a driving control chip, a touch control chip and a protective structure. The flexible circuit board is bonded to the display panel. The driving control chip is located on the display panel or the flexible circuit board. The touch control chip is located on the flexible circuit board or the display panel. The protective structure covers the driving control chip and/or the touch control chip. And the protective structure includes a first insulating layer, a heat dissipation layer and an electromagnetic shielding layer that are sequentially disposed away from the display panel.

The disclosure relates to a filter circuit on an electric motor which has electrical connections at a connection end for connection to a supply voltage (U). The filter circuit consists of at least one capacitor bridge arranged between the connections of the electric motor for radio interference suppression. For increased electromagnetic compatibility (EMC), the filter circuit is arranged on a circuit board and held on the connection end of the electric motor. The circuit board has a capacitor bridge with interference suppression capacitors, which is connected between the electrical connections of the electric motor, wherein an interference suppression capacitor has a longitudinal axis between its electrical connections in the longitudinal direction. The interference suppression capacitors are arranged on the circuit board with their longitudinal axes aligned in different spatial directions.

A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.

A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate, the first wiring portion and the second wiring portion are spaced apart from each other and are electrically connected to the first bridge end and the second bridge end, respectively; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion for a first functional wiring line on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively. The wiring layout of the flexible printed circuit is simple and is easy to be manufactured.

The present disclosure provides an electromagnetic shielding film, a flexible circuit board and a display device. The electromagnetic shielding film includes a central portion and an edge portion. The central portion has a plurality of surrounding side edges; and the edge portion is provided on at least one side edge of the central portion, and includes a plurality of protruding units protruding away from the central portion. The plurality of protruding units are arranged in an extending direction of the side edge where the edge portion is located. The electromagnetic shielding film is used to attach on a flexible circuit board body, the central portion is located on a non-bending area, and the edge portion is located on a bending area, so that the flexible circuit board is formed.

A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

A rigid-flex printed circuit board includes an inner circuit substrate, two adhesive sheet layers formed on the inner circuit substrate, two shielding structures, and two outer circuit layers. The inner circuit substrate is divided into a flexible area, a first and second rigid area. Each shielding structure includes a copper layer, a metal seed layer formed on the copper layer, a flexible dielectric layer formed on the metal seed layer, and a backing adhesive sheet layer formed on the flexible medium layer. The backing adhesive sheet layer is pressed on the adhesive sheet layer and the inner circuit substrate located in the flexible area. Each outer circuit layer is formed on the copper layer, located in the first rigid area and the second rigid area and electrically connected to the inner circuit substrate.