A reinforcing member for a flexible printed wiring board allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential. The reinforcing member includes a metal base and a nickel layer formed on a surface of the metal base. The nickel layer includes phosphorus in a range from 5.0 percent by mass to 20.0 percent by mass, the rest of the nickel layer is nickel and inevitable impurities, and the nickel layer is 0.2 μm to 0.9 μm thick.

A high-frequency module includes a multilayer substrate that includes an insulator layer and a wiring electrode, a component on one main surface of the multilayer substrate, a resin layer on the one main surface so as to cover the component, and a shield electrode covering at least a portion of a surface of the resin layer and at least a portion of a side surface of the multilayer substrate. The wiring electrode includes a capacitor via electrode that is spaced away from the shield electrode inside the multilayer substrate, and a first capacitor is defined by the shield electrode and the capacitor via electrode.

An electronic component mounting board includes: a circuit board having a wiring layer; a pocket part provided on a main surface of one side of the circuit board; a passive component housed in the pocket part; an active component arranged above the passive component and the main surface of the one side of the circuit board and connected to the passive component; and a shield layer formed of a material containing a magnetic material and provided between a bottom surface of the pocket part and a lower surface of the passive component.

A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.

An electronic device module includes: a substrate; a sealing portion disposed on a first surface of the substrate; an exothermic device disposed on the first surface of the substrate and embedded in the sealing portion; and a heat radiating portion at least partially embedded in the sealing portion. A lower surface of the heat radiating portion is bonded to one surface of the exothermic device. A side surface of the heat radiating portion is curved and is entirely in contact with the sealing portion. A plurality of grooves are disposed in the side surface of the heat radiating portion.

A free grounding film and a manufacturing method therefor, and a shielding circuit board including the free grounding film and a grounding method. The free grounding film includes at least one conductor layer. The shielding circuit board including the free grounding film is formed in a manner that an electromagnetic wave shielding film is arranged on a printed circuit board, and the upper surface of the electromagnetic wave shielding film is provided with the free grounding film. The grounding method for the shielding circuit board adopts one of three modes.

The present subject matter relates to a battery module for use in a vehicle. The battery module may include a housing, a plurality of battery cells disposed within the housing, and solid state pre-charge control circuitry that pre-charges a direct current (DC) bus that may be coupled between the battery module and an electronic component of the vehicle. Furthermore, the solid state pre-charge control circuitry may include solid state electronic components as well as passive electronic components.

A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.