A high frequency flexible flat cable includes a first metal isolation layer, a first low-k dielectric adhesive layer attached to one side of the first metal isolation layer, a second low-k dielectric adhesive layer attached another side of the first metal isolation layer and at least two conductor layers respectively attached to the first low-k dielectric adhesive layer and the second low-k dielectric adhesive layer. In addition, the high frequency flexible flat cable further includes a third low-k dielectric adhesive layer, a fourth low-k dielectric adhesive layer, a second metal isolation layer and a third metal isolation layer. The second metal isolation layer and the third metal isolation layer are respectively adhered to outsides of the conductor layers by using the third low-k dielectric adhesive layer and the fourth low-k dielectric adhesive layer to adjust the impedance of the high frequency flexible flat cable according to requirements.

Embodiments described herein may be related to apparatuses, processes, and techniques related to a shielding layer to be inserted under an inductor footprint to mitigate the impact of electromagnetic interference (EMI) onto electrical traces beneath the shielding layer and under the inductor footprint. In embodiments, the electrical traces may be high-speed input/output (HSIO) traces that may be particularly susceptible to data corruption given the level of EMI. In embodiments, the shielding layer may be a high density metallization shield within dielectric stack-up layers. In embodiments, these layers may use unique via patterns or shaped metal preform shields to enable routing under an inductor at a higher layer of the PCB. Other embodiments may be described and/or claimed.

A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

An electronic component module includes a first module including a sealing portion disposed on a first surface of a first board and a shielding layer disposed on a surface of the sealing portion, a second module spaced apart from the first module, a connection board having greater flexibility than the first board and connecting the first module to the second module, and a first ground line electrically connected to a ground layer of the first board and disposed on a surface of the connection board, and at least a portion of the shielding layer is electrically connected to the ground layer of the first board.

Embodiments of the present disclosure are directed to a substrate with a plurality of layers including a top layer, one or more intermediate layers and a bottom layer. Ferromagnetic material applied to a first of the one or more intermediate layers in an area underneath a magnetic source disposed on an outer surface of the top layer, where the ferromagnetic material is to provide a shield for signal routing traces in one or more other intermediate layers or the bottom layer underneath the first intermediate layer, from a magnetic field produced by the magnetic source. Other embodiments may be described and/or claimed.

An integrated antenna assembly includes one or more antenna elements, one or more electronics components, and one or both of a static discharge element disposed between the antenna element(s) and the electronics component(s) and/or one or more thermal dissipators.

A connector has a main portion formed as a part of a multilayer wiring board and having a tongue shape. The multilayer wiring board is provided with a surface conductive layer and an inner conductive layer. The inner conductive layer is located apart from and inward of the surface conductive layer in an up-down direction. The main portion is provided with a grounding plate formed in the surface conductive layer and a plurality of contacts formed in the inner conductive layer. Each of the contacts is, at least in part, exposed and contactable in the up-down direction. Since the grounding plate and the contacts are formed in the conductive layers of the multilayer wiring board, the connector can possess desired electric characteristics in high accuracy.

A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor.