Shielded and packaged electronic devices, electronic assemblies, and methods are disclosed herein. The shielded and packaged electronic devices include a packaged electronic device with a package surface and a plurality of electrically conductive package pads arranged on the package surface, a shielding dielectric layer extending in contact with the package surface and having a shielding layer surface and a plurality of openings that extends between the shielding layer surface and the plurality of electrically conductive package pads, and a plurality of electrical conductors that extends from the plurality of electrically conductive package pads and projects from the shielding layer surface. The electronic assemblies include a printed circuit board with a board surface and a plurality of electrically conductive board pads arranged on the board surface, the shielded and packaged electronic device, and an underfill dielectric layer. The methods include methods of manufacturing the electronic assemblies.

Systems, apparatuses, and methods related to a printed circuit board (PCB) with a plurality of layers are described. An edge connector may be formed on an end of the PCB substrate and may include contact pins on an outer layer of the plurality of layers. The edge connector may also include an intra-pair coupling block disposed on one or more interior layers such that at least a portion of the intra-pair coupling block is colinear with at least one contact pin on the outer layer. The electronic device may also include at least one integrated circuit on the PCB and electrically connected to the contact pins. The intra-pair coupling component may induce coupling of signals carried by the contact pins.

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

An assembly comprises a circuit board structure and a plurality of connection portions. The circuit board structure has a main circuit board and a supplemental circuit board. The main circuit board is formed with an accommodating portion. The accommodating portion is recessed downward in an up-down direction from an upper surface of the main circuit board. The main circuit board has a plurality of upper main conductive portions which are formed on the upper surface of the main circuit board. The supplemental circuit board has a plurality of upper supplemental conductive portions which are formed on an upper surface of the supplemental circuit board. The supplemental circuit board is, at least in part, accommodated in the accommodating portion. Each of ones of the connection portions connects a respective one of the upper main conductive portions and a respective one of the upper supplemental conductive portions with each other.

A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.

A wiring board includes an insulating layer that is formed by using insulating resin and a wiring layer that is formed on a surface of the insulating layer. The wiring layer includes a first area in which a wire is formed, and a second area that includes a pad to which the wire formed in the first area is connected and that has a smaller wire width than the first area. The insulating layer includes a conductor portion that is formed by using a conductor in only a range that overlaps with the second area in plan view, and that is sandwiched between insulating resin.

A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

An electronic device has a control board having a plurality of wiring layers, a metal-made housing supporting the control board, and a fixing screw for fixing the control board to the housing through a washer. The control board includes a through hole penetrating from a third surface to a fourth surface, a through electrode formed inside the through hole, and a power system GND pattern formed on any wiring layer of the wiring layers. The power system GND pattern and the housing are electrically coupled through the through electrode, the washer, and the fixing screw.

A printed circuit board (PCB), electronic assembly, and method are provided. A PCB adapted to receive a radio frequency (RF) chip includes one or more features that extend through at least a portion of the depth of the PCB. The features are filled with an RF absorber composite comprising a binder and an RF absorber material. The features are positioned in the PCB to reduce RF signal coupling between the RF chip and one or more metal surfaces of the PCB.

A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the insulating resin base material layers. A plurality of openings are provided in the ground conductor, and an aperture ratio is higher in a zone far from the signal line than in a zone adjacent to or in a vicinity of the signal line in a direction perpendicular or substantially perpendicular to the laminating direction.