A first resin layer (1) has: a covered region which is covered by a second resin layer (2) and an exposed region (1a); a contact part (1b) which is provided in the exposed region (1a); and a bend part (1c) which is provided between (a) a boundary between the covered region and the exposed region (1a) and (b) the contact part (1b).

An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, substantially surrounding the first layer in the first plane. Other embodiments are described herein.

An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.

Receiver (1), in particular an implantable receiver (1) for transmitting energy to an implant, with a multi-layer circuit board comprising a plurality of electrically conductive layers (11-16), wherein the circuit board comprises an outer coil area and a multi-layer inner area enclosed by the coil area, a coil which is integrally incorporated at least partially in the layers (11-16) of the circuit board in the coil area, wherein the number of the layers (11-16) of the circuit board is smaller within this inner area than in the coil area.

LED board interconnect schemes for illuminable assemblies are provided. Multiple LED boards may form a partial perimeter along an illuminable assembly. The multiple LED boards and interconnects must fit within a limited width and height of the illuminable assembly. In some implementations, an interconnect board and spring connectors are used to provide a low-profile electrical interconnection while maintaining co-planarity of the LEDs across the LED boards.

A process for creating wiring on a curved surface, such as the surface of a contact lens, includes the following. Creating a groove or trench in the curved surface. Forming a seed layer on the surface and on the groove. Removing the seed layer from the surface while leaving some or all of it in the groove. Depositing conductive material in the groove. Preferably, the deposited conductive material is thicker than the seed layer.

An arrangement is provided comprising a circuit carrier and a heat sink. The circuit carrier has at least one arc-shaped curved region, and the heat sink also has at least one arc-shaped curved region. The arc-shaped curved region of the circuit carrier is either inwardly or outwardly curved, and the arc-shaped curved region of the heat sink is the opposite either outwardly or inwardly curved. The contour of the arc-shaped curved region of the circuit carrier corresponds to the contour of the arc-shaped curved region of the heat sink. The curved region of the heat sink and the curved region of the circuit carrier are connected to one another.

A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate. The method includes applying a first layer of paint to the first layer of the multi-layer circuit. The method includes forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint and electrically coupled to the first layer of the multi-layer circuit. The method includes applying a second layer of paint over the second layer of the multi-layer circuit and forming, by the laser direct structuring process, a third layer of the multi-layer circuit on the second layer of the paint and electrically coupled to the second layer of the multi-layer circuit.

A printed circuit board (PCB) including a rigid dielectric layer having a curved geometry, and a conductive layer attached to the dielectric layer. A method for making a printed circuit board (PCB) including depositing a layer of dielectric material onto a surface, curing and sintering the material on the surface, depositing a first layer of conductive material on the layer of dielectric material, and depositing a second layer of conductive material on the first layer of conductive material, the second layer being thinner in cross section than the first layer. A system for producing a curved rigid PCB including a housing, a build platform disposed in the housing, a mobile robotic depositor disposed upon the build platform, and a print head disposed in the housing and in printing proximity to the build platform, the head having a plurality of deposition nozzles and a laser.

A method of manufacturing a curved electronic device (100) and resulting product. A patterned layer of non-conductive support material (12m) is printed onto a thermoplastic substrate (11) to form a support pattern. An electrical circuit (13,14) is applied onto the support pattern (12), wherein the electrical circuit (13,14) comprises circuit lines (13) comprising a conductive material (13m) applied onto support lines (12b) of the pattern and electrical components (14) applied onto support islands (12a) of the pattern. A thermoforming process (P) is used for deforming (S) the substrate (11) while a relatively high resistance of the support material (12m) to the deforming maintains a structural integrity of the electrical circuit (13,14).