The display device includes: a display panel; a first circuit board having a first portion connected to one portion of the display panel and comprising a connector; and a second circuit board electrically connected to the first circuit board through the connector, wherein the first portion includes a base film, a dummy pad disposed on the base film, and a first solder mask partially covering the dummy pad and exposing a portion of the dummy pad, the dummy pad includes a covered region covered by the first solder mask and an exposed region exposed by the first solder mask, and a solder ball, The exposed region of the dummy pad is connected to the connector through a solder ball.

A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

A multiple board standoff for interconnecting a plurality of electronic boards, such as printed circuit boards, having at least one keyhole slot. The standoff comprises a plurality of major diameter portions, a plurality of minor diameter portions each disposed between two of the plurality of major diameter portions, and a plurality of abutment surfaces each transversely extending from one of the major diameter portions to one of the minor diameter portions. At least one of the minor diameter portions is configured to be inserted into the keyhole slot when the standoff is in a first orientation with respect to the electronic board and being retained within the keyhole slot when the standoff is in a second orientation with respect to the electronic board.

A circuit substrate for carrying at least one light-emitting diode and a light-emitting structure for providing illumination are disclosed. The circuit substrate includes an insulation base layer, a conductive heat-dissipating layer, an insulation covering layer, a conductive circuit structure and a conductive through structure. The conductive heat-dissipating layer is disposed on the insulation base layer. The insulation covering layer is disposed on the conductive heat-dissipating layer. The conductive circuit structure includes a first electrode conductive layer and a second electrode conductive layer that are disposed on the insulation covering layer. The conductive through structure passes through the insulation covering layer and is connected between the conductive heat-dissipating layer and one of the first electrode conductive layer and the second electrode conductive layer. One of the first electrode conductive layer and the second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body.

A flexible electronic pathway, such as a flat flexible cable or flexible circuit, includes a cut-out within the pathway to provide strain relief by balancing the stress over the termination area. The flexible electronic pathway allows relative movement between a first end and a second end in all three translation, all three rotation directions, and combinations thereof. The strain relief can provide for a controlled mechanical resistance to reduce the risk of damage and failure.

To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate (10); a first signal line (L31) formed on the insulating substrate (10); a second signal line (L32) having a shorter length than that of the first signal line (L31); and a ground layer (30) formed for the first signal line (L31) and the second signal line (L31) via an insulating material (10). The ground layer (30) includes a first ground layer (G31) corresponding to a first region (D1) and a second ground layer (G32) corresponding to a second region (D2). The first region (D1) is defined based on the first signal line (L31) and has a first predetermined width (W31). The second region (D2) is defined based on the second signal line (L32) and has a second predetermined width (W32). The first ground layer (G31) has a remaining ratio lower than a remaining ratio of the second ground layer (G32).

An object of the present invention is to obtain a wiring board that achieves both of high mounting position accuracy and high solder strength in a circumferential direction. On the wiring board, an electronic component including a plurality of pins is mounted. The wiring board includes a base substrate, a plurality of wires provided on the base substrate, a resist covering the wires, and a plurality of footprints connected to the wires and having entire surfaces exposed in openings of the resist. The pins are soldered to the footprints by reflow. In the openings of the resist, directions in which the pins are led out are parallel to directions in which the wires are led out.

A memory card includes a case and an integrated circuit package disposed in the case. The case includes a first case edge, a second case edge connected to the first case edge, a third case edge connected to the second case edge, a fourth case edge connected to the third case edge and the first case edge, and a first recessed groove formed in the second case edge, the first recessed groove being spaced apart from the first case edge and inwardly recessed. The integrated circuit package is disposed in an upper portion of the case between the first case edge and a first horizontal line that extends in a direction from a top end of the first recessed groove in the second case edge to the fourth case edge.

Technologies are generally described for lead-lag dampers. An example lead-lag may include a single- or two-stage floating annular ring, elastomer bearings, a tension stop, a compression stop, and a plunger/spring volume compensator. The floating annular ring(s) form orifice(s) in conjunction with the remaining damper components may provide stable performance by tracking with any center shaft misalignment during operation. The lead-lag damper may also include a secondary spring system allowing or disallowing fluid flow between chambers based on slow or sudden movement of the shaft.

A circuit card assembly (CCA) for reduced susceptibility to load deformation when mounted at peripheral mounting portions is provided. The CCA includes a circuit card including a face to which components are operably connectable, a plate defining openings that correspond to the components, the plate being disposable adjacent to the face with the components extending at least partially through the openings and adhesive interposed between the face and the plate.