Methods and systems for fabricating 3D electronic devices, such as multielectrode arrays, including metalized, 3D printed structures using integrated 3D printing and photolithography techniques are disclosed. As one embodiment, a multielectrode array comprises a flexible substrate, a plurality of photopatterned electrical traces spaced apart and insulated from one another on the substrate, and a plurality of 3D printed electrodes. Each 3D printed electrode comprises a photopolymer coated in metal and has a 3D structure that extends outward from the substrate, and each 3D printed electrode is electrically connected to a corresponding electrical trace of the plurality of photopatterned electrical traces.

A flexible circuit structure includes: a flexible substrate having a surface; a plurality of first pads disposed on the surface; and an insulating layer disposed on the surface and between two adjacent first pads of the plurality of first pads, wherein the insulating layer has a first maximum height in a normal direction of the surface, one of the plurality of first pads has a second maximum height in the normal direction of the surface, and the first maximum height is less than or equal to the second maximum height.

A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.

A wiring board including a component mounting portion with an increased strength is provided. In addition, an electronic device and an electronic module with high reliabilities are provided. The wiring board includes a base having a first face and a conductor positioned on the first face. The conductor has a region in which a plurality of first protrusions are positioned on a surface of the conductor, the plurality of first protrusions protruding in a same oblique direction that is oblique to a direction normal to the first face. The electronic device and the electronic module include the above-described wiring board and an electronic component mounted on the wiring board.

A substrate that is stretchable; wiring positioned on a first surface side of the substrate, the wiring having a meandering shape section including peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The substrate has a component region and a wiring region adjacent to the component region. The component region includes a component-fixing region overlapping an electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate and a component-surrounding region positioned around the component-fixing region. The stretching control mechanism is positioned in the component-surrounding region and at least includes a stretching control part that spreads to the border between the component-surrounding region and the component-fixing region.

A substrate with an antenna according to the present disclosure includes a circuit board having one main surface and the other main surface, and an antenna element mounted on the one main surface of the circuit board. When viewed from a thickness direction, an area of the one main surface of the circuit board is larger than an area of the other main surface, and the antenna element is mounted on at least a part of a region that is on the one main surface of the circuit board and that protrudes from the other main surface.

A flexible wiring board that includes a flexible substrate; a flexible wiring over the flexible substrate; and a protective layer over the flexible substrate, where the protective layer includes: a first region that overlaps with the flexible wiring and a second region that does not overlap with the flexible wiring as viewed from a thickness direction of the flexible substrate, and a low flexibility part that is higher in flexibility ratio than the first region and is disposed along an extending direction of the flexible wiring in the second region.

The present invention includes a method of fabricating an integrated RF power condition capacitor with a capacitance greater than or equal to 1 nf and less than 1 mm.sup.2, and a device made by the method.

A method of forming a structural honeycomb includes cutting and folding a substrate sheet according to predetermined cutting and folding patterns and fold angles that cause the sheet to form a honeycomb having cells that each have at least one face abutting, or nearly abutting, the face of another cell. The honeycomb is then stabilized by joining abutting, or nearly abutting, faces to hold the honeycomb together. The honeycomb may have a prespecified three-dimensional shape. The folding pattern may include corrugation, canted corrugation, or zig-zag folds. Joining may employ fixed and/or reversible joinery, including slotted cross section, tabbed strip, angled strip, integral skin, sewn, or laced. At least some folds may be partially-closed to create bends and twists in the honeycomb structure. Some surfaces of the honeycomb may be covered with a skin or face sheet. The substrate sheet may have flexible electronic traces.

The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.