The invention relates to a method for producing a substrate structured by nanowires, characterized in that no lubricant and no lithographic resist mask is used in the method, and only by moving a donor substrate having nanowires relative to a substrate and by locally tribological properties on the surface of the substrate, a specified number of nanowires is deposited selectively at locally defined points of the substrate. The invention further relates to a substrate that can be produced using the method according to the invention, and which selectively contains a specified number of nanowires on a surface at locally defined points. The invention further relates to the use of the substrate according to the invention in microelectronics, microsystems technology, and/or micro-sensor systems.

A connection body comprises a body having upper and lower surfaces, a first path and a second path. The first path has a first wired portion configured to be connected to a first core wire of a cable structure and a first terminal portion coupled to the first wired portion by a first coupling portion. The first wired portion, the first terminal portion and the first coupling portion are formed on the upper surface of the body. The second path has a second wired portion configured to be connected to a second core wire of the cable structure and a second terminal portion coupled to the second wired portion by a second coupling portion. The second wired portion is formed on the upper surface of the body. The second terminal portion is formed on the lower surface of the body.

There is provided a computer readable storage medium storing a program executable by a computer, and the program causes the computer to execute functions including: forming a first image in accordance with an electronic circuit diagram, in which a resistance value of a wiring portion is defined, to form the wiring portion by printing with a conductive ink; and correcting the first image in accordance with a second image, which is formed with a photothermal conversion material, when the first image is formed at least partially overlapping the second image, wherein the second image is an image for expanding a thermally expandable layer that thermally expands with heat and, when the image is irradiated with light, expanding the thermally expandable layer by converting the light into heat with the photothermal conversion material.

A wiring body includes a conductive portion that includes a contact surface having a concave-convex shape, and an adhesive layer stacked on the contact surface. The conductive portion further includes a top surface facing the contact surface that contains conductive particles. The adhesive layer includes a smooth portion with a smooth main surface provided at a constant thickness, and a protrusion that protrudes from the main surface toward a side of the conductive portion provided on the smooth portion to correspond to the conductive portion. The protrusion comes into contact with the contact surface and includes a concave-convex surface complementary to the concave-convex shape of the contact surface. The contact surface is positioned on a side of the top surface with respect to the main surface and a unit length of the contact surface is larger than a unit length of the top surface.

A display apparatus includes a display panel configured to display an image and including a first pad part, the first pad part including a plurality of first pads disposed at a first edge thereof, and a printed circuit board having an insertion hole in which at least a portion of the first edge of the first pad part is accommodated. The printed circuit board includes a plurality of first terminals disposed on an inner surface of the insertion hole to contact the plurality of first pads.

A printed circuit board may include a top side, a bottom side, and a circumferential surface that connects the top side to the bottom side. The circumferential surface may have a toothing for forming a gear wheel. The toothing may be circumferentially closed and may be arranged over an entire surface area of the circumferential surface. The toothing may be configured as an involute toothing, an epicycloid toothing, a hypocycloid toothing, or a lantern gear toothing. The printed circuit board may be formed of fiber-reinforced plastic. Further, the printed circuit board may include a track, a surface structure, and/or a conductor track configured for inductive sampling, capacitive sampling, optical sampling, and/or acoustic sampling.

A first resin layer (1) has: a covered region which is covered by a second resin layer (2) and an exposed region (1a); a contact part (1b) which is provided in the exposed region (1a); and a bend part (1c) which is provided between (a) a boundary between the covered region and the exposed region (1a) and (b) the contact part (1b).

A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

Receiver (1), in particular an implantable receiver (1) for transmitting energy to an implant, with a multi-layer circuit board comprising a plurality of electrically conductive layers (11-16), wherein the circuit board comprises an outer coil area and a multi-layer inner area enclosed by the coil area, a coil which is integrally incorporated at least partially in the layers (11-16) of the circuit board in the coil area, wherein the number of the layers (11-16) of the circuit board is smaller within this inner area than in the coil area.

The present disclosure provides a power module, a chip-embedded package module and a manufacturing method of the chip-embedded package module. The chip-embedded package module includes: a chip having a first surface and a second surface that are disposed oppositely; a first plastic member including a first cover portion and a first protrusion; and a second plastic member including a second cover portion and a second protrusion. A height difference discontinuous interface structure is formed between the top surface of the second protrusion and the second surface of the chip, which cuts off a passage for expansion of delamination at an edge position of the chip, thereby effectively suppressing generation of the delamination.