A wiring board includes a substrate, wiring, and a reinforcing part. The substrate is stretchable, and includes a first surface and a second surface located opposite to the first surface. The wiring is located at the first surface side of the substrate. The reinforcing part overlaps the wiring when viewed in a direction normal to the first surface of the substrate. The substrate has a control region and a non-control region. The control region overlaps the reinforcing part. The non-control region does not overlap the reinforcing part. The non-control region is positioned to sandwich the control region in a direction orthogonal to the direction in which the wiring extends.

Disclosed is a wiring board, including: a base body having insulating properties; and a wiring conductor positioned on the base body. The base body has a first surface, a fourth surface positioned opposite to the first surface, and a second surface and a third surface positioned at side surfaces between the first surface and the fourth surface. The first surface, the second surface, and the third surface are mounting surfaces for respective electronic components, and the fourth surface is an installation surface.

A payment reader is provided for use in a payment system. The payment reader includes a housing, a non-conductive cover covering the housing and forming an internal compartment, electronic circuitry within the internal compartment and surrounded by the cover, and a mesh of conductive traces provided on the cover and in communication with the electronic circuitry. The cover has an upper wall and interconnected side walls depending downwardly from the upper wall. The lower surface of the upper wall which faces the internal compartment has its entire surface area which is formed of at least one three-dimensional shape which extends outwardly from an x-y plane in the z-direction.

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die.

Provided is an insulating circuit board including: an insulating resin layer; and a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein thickness of each of the metal pieces constituting the circuit layer is 0.5 mm or more, the insulating resin layer is made of a thermosetting resin, and a void ratio in regions between the metal pieces is 0.8% or less.

Electrical connector assemblies mountable on a tire of a wheel of a vehicle are described. An electrical connector assembly may include one or more electrical conductors, a respective electrical conductor extending from an inside surface of the tire to an outside surface of the tire. Tire assemblies including at least partially embedded electrical connector assemblies and wheel assemblies including such tire assemblies are also described.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

A flexible base substrate, a manufacturing method thereof, and a display device are provided. The flexible base substrate includes a first flexible substrate. The first flexible substrate includes: a first flexible film layer including a flexible film layer body, and a plurality of protrusions spaced apart from each other on a surface of a side of the flexible film layer body; a first spacer layer on the first flexible film layer and including a plurality of first islands spaced apart from each other; and a first groove between adjacent first islands. The first groove is filled with a first organic material, and a height of the first organic material is smaller than a height of the first groove in a direction perpendicular to the flexible film layer body.

A sensor unit includes a circuit board including, on a first surface, a plurality of electrode pads to which a plurality of mounting terminals of an inertial sensor are respectively attached via connecting members. The first surface of the circuit board includes an insulating layer provided on the outer side of the plurality of electrode pads in a plan view, includes, in a portion overlapping a center region further on the inner side than the mounting terminals of the inertial sensor in the plan view, a first region where the insulating layer is not provided, and includes, from the first region to the outer side of the inertial sensor in the plan view, a second region where the insulating layer is not provided.