A production method and a power electronic connecting device for a power semiconductor module, wherein the connecting device is designed as a flexible film stack of a first and a second electrically conductive film and an electrically insulating film arranged therebetween, wherein at least one of the electrically conductive films is structured in itself and thus forms a plurality of film conductor tracks, wherein a first one of these film conductor tracks has, in a first section, a first average thickness and, in a second section, a second average thickness which is at least 10%, preferably at least 20%, smaller than the first average thickness.

A component carrier includes a stack having a first electrically insulating layer structure and a first electrically conductive layer structure arranged on the first electrically insulating layer structure. The first electrically insulating layer structure has at least one first covered portion, which is covered by the first electrically conductive layer structure, and at least one first non-covered portion, which is not covered by the first electrically conductive layer structure. The first electrically insulating layer structure defines a recess at the at least one first non-covered portion.

A payment reader is provided for use in a payment system. The payment reader includes a housing, a non-conductive cover covering the housing and forming an internal compartment, electronic circuitry within the internal compartment and surrounded by the cover, and a mesh of conductive traces provided on the cover and in communication with the electronic circuitry. The cover has an upper wall and interconnected side walls depending downwardly from the upper wall. The lower surface of the upper wall which faces the internal compartment has its entire surface area which is formed of at least one three-dimensional shape which extends outwardly from an x-y plane in the z-direction.

A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).

An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.

The elastomeric electrode includes: a stretchable substrate 10 having wrinkles formed on one surface thereof, the peaks C and valleys T of the wrinkles being repeated; a wrinkled metal nanoparticle layer 20 including metal nanoparticles 21 and formed by deposition of the metal nanoparticles along the wrinkles of the substrate 10; and a wrinkled monomolecular layer 30 including a monomolecular material having one or more amine groups (—NH.sub.2) and formed by deposition of the monomolecular material onto the metal nanoparticle layer 20. Also disclosed is a method for preparing the elastomeric electrode.

A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.

Embodiments may relate to a microelectronic package with an interconnect stack that includes a cavity therein. The cavity may include a dielectric material with a dielectric value less than 3.9. The microelectronic package may further include first and second conductive elements in the cavity, with the dielectric material positioned therebetween. Other embodiments may be described or claimed.

Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.

A stretchable wiring body includes: a conductor that includes a binder and conductive particles dispersed in the binder; and soft resins that are embedded in the binder and are softer than the binder. The conductive particles are not covered with the soft resins.