Provided is stretchable electronics. The stretchable electronics includes stretchable substrate, first support patterns disposed on a first surface of the stretchable substrate, and output devices disposed on the first patterns, respectively. The first support patterns are arranged in a first direction and a second direction, which are parallel to an extension direction of the substrate, and each of the output devices generates an output stimulation.

A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.

A flexible membrane adapted to carry high-frequency power signals is described having a plurality of contact pads in a central portion of the flexible membrane connected to a plurality of micro contact probes and a plurality of contact structures connected to a support plate in a peripheral portion of the flexible membrane, as well as a plurality of conductive tracks connecting the contact pads with the contact structures. The flexible membrane further includes an intermediate portion between the central and peripheral portions. The elastic membrane is divided into a first area having a first total thickness and into a second area having a second total thickness. The first area is contiguous and adjacent to the second area. The first total thickness is less than or equal to 75 m and the second total thickness is greater than the first total thickness.

A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.

The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.

The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.

A cable assembly includes an insulating housing, a center plate fastened in the insulating housing, and a terminal assembly fastened in the insulating housing. The center plate has a base plate. Rears of two opposite sides of the base plate are connected with two connecting feet. A pair of the bending arms are connected with the rears of the two opposite sides of the base plate. The pair of the bending arms have two bending portions, two extending arms and two hooking portions. The two extending arms include two first extending portions, two connecting portions and two second extending portions. The two hooking portions have two first bending feet, two second bending feet and two third bending feet. The two connecting portions and the two second extending portions are exposed out of the insulating housing. The two first bending feet are exposed out of the insulating housing.

A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).

A fingerprint identification apparatus and an electrode device. The fingerprint identification apparatus could be configured to be disposed under a variety of different display screens, reducing a thickness of space for installation of the fingerprint identification apparatus under a screen. The fingerprint identification apparatus includes: a support plate; and at least one fingerprint sensor chip, the at least one fingerprint sensor chip being disposed at an upper surface of the support plate; where the support plate is configured to be mounted to an upper surface of a middle frame of the electronic device so that the at least one fingerprint sensor chip is located under the display screen of the electronic device; and the at least one fingerprint sensor chip is configured to receive a fingerprint detecting signal returned by reflection or scattering via a human finger on the display screen.

A flexible base substrate, a manufacturing method thereof, and a display device are provided. The flexible base substrate includes a first flexible substrate. The first flexible substrate includes: a first flexible film layer including a flexible film layer body, and a plurality of protrusions spaced apart from each other on a surface of a side of the flexible film layer body; a first spacer layer on the first flexible film layer and including a plurality of first islands spaced apart from each other; and a first groove between adjacent first islands. The first groove is filled with a first organic material, and a height of the first organic material is smaller than a height of the first groove in a direction perpendicular to the flexible film layer body.