A method is provided for producing circuit boards with perforated shaped parts. The perforated shaped parts are arranged and fixed relative to one another in a specified configuration in order to form a semi-finished product with a perforated mask, wherein the semi-finished product is then positioned in a press using the perforated mask and is pressed together with at least one other element in order to form a circuit board substrate for producing a circuit board. A system is also provided for producing circuit boards in order to prepare corresponding semi-finished products and processing same in order to form a circuit board substrate for producing a circuit board.

A method for manufacturing a flexible printed circuit board, comprising: providing a flexible printed circuit substrate; defining first through holes and second through holes through the flexible printed circuit substrate; and forming first conductive pillars and second conductive pillars; and defining first grooves by removing a portion of each first conductive pillar and defining second grooves by removing a portion of each second conductive pillar; the first grooves and the second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the first grooves is aligned with and corresponds to one first conductive pillar, and each of the second grooves is aligned with and corresponds to one second conductive pillar.

A mounting assembly includes an electronic component mounted on an upper surface of a circuit board and having at least one electrical connector and a thermal pad provided on a lower surface of the component. The circuit board is mounted on a heatsink and provided with an opening beneath the thermal pad of the component. The heatsink has a heatsink extension which extends through the circuit board and is spatially separated therefrom. A thermal interface material is provided to ensure an electrically insulating thermal connection between the thermal pad and the heatsink extension.

The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S100 in which a material of a metal PCB 14 is prepared, a step S110 in which a circuit pattern 22 and a plurality of unit patterns 16 are formed and cut from the material of a metal PCB 14 to form a metal PCB 14, a step S120 in which a bending groove 24 is formed on a bottom surface of the metal PCB 14, a step S130 in which each of the unit patterns 16 is protruded forward around the bending groove 24 of the metal PCB 14 such that each of the unit patterns 16 is bent to be inclined from the metal PCB 14, and a step S140 in which a stepwise injection molded products 12 is coupled with the metal PCB 14 while the unit pattern 16 is protruded.

A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.

Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

Provided are a metal PCB, a headlight module having the metal PCB applied thereto, and a method for assembling the headlight module, wherein the metal PCB has a base made of a metal material and configured as a thin plate, or the base has a predetermined thickness and is bent in a desired direction through a bending groove formed on the rear surface thereof, and the base has a plurality of chip mounting portions integrated thereon such that one or more LED chips are mounted thereon, the chip mounting portions being spaced at a predetermined interval and having at least two parts of incision surfaces formed on one side of the base such that the chip mounting portions are inclined and installed to have a predetermined angle with regard to the base.

The disclosure discloses a metal foil, a metal foil with a carrier, a copper-clad laminate and a Printed Circuit Board. Herein, a plurality of protrusions are distributed on one face of the metal foil, and the protrusions have the follow microscopic morphology: the lower half part of the protrusion connected with the one face of the metal foil is provided with a limiting part, and the diameter of a circumscribed circle of the cross section of the limiting part is smaller than the skin depth of the metal foil; and the surface area of the part of the protrusion above the limiting part is larger than the surface area of other parts of the protrusion.

A method for manufacturing a circuit board includes: preparing a first substrate and a second substrate, wherein: the first substrate comprises a convex post member formed at a top surface of the first substrate, and the second substrate including a first surface and a second surface opposite to the first surface, and comprising: a first metal layer formed on at least the first surface, and an opening through which a top surface of the post member is uncovered in a plan view; bonding at least a portion of a top surface of the first substrate excluding the post member and the second surface of the second substrate so that the top surface of the post member is uncovered through the opening; and forming a circuit pattern by removing a first portion of the first metal layer.

An LED panel includes a support having a first side, a second side opposite the first side, and a window that extends from the first side to the second side. An LED is affixed to the first side. A diverter affixed to the second side. The diverter includes an angled portion, wherein the angled portion extends over a window portion that is less than all of the window.