A main board for a computer device can include main board components arranged on a first surface of the main board and Trusted Platform Module (TPM) components arranged on the first surface of the main board. The TPM components can be located in a predetermined area of the main board that is detachable from the main board (e.g. by means of a predetermined break line). A method for producing an embodiment of the main board with an integrated TPM can include producing a Printed Circuit Board (PCB); arranging a plurality of main board components in a first area of the PCB; and arranging TPM components in a second area of the PCB that is a detachable predetermined area of the main board. A predetermined breakline which at least partly surrounds the predetermined area can be formed by drilling holes to form a perforated line.

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.

The invention provides a printed circuit board (10) including a first electrically conductive track (210), wherein the printed circuit board (10) comprises a set (15) of two printed circuit board areas (100) both comprising a part of the first electrically conductive track (210), wherein printed circuit board (10) further comprises a perforation line (300) between the two printed circuit board areas (100) for customizing the printed circuit board (10) into two physically separated printed circuit board area comprising parts (1100), wherein the perforation line (300) is configured as a non-straight line, wherein the perforation line (300) comprises relative to one of the printed circuit board areas (100), and in a plane of the printed circuit board (10), a first projecting part (311) and a first recessed part (312), wherein the first recessed part (312) is recessed relative to the first projecting part (311), wherein the first electrically conductive track (210) is intercepted by the perforation line (300) at the first recessed part (312).

In example implementations, a system board is provided. The system board includes a printed circuit board and an extended portion. The printed circuit board includes an electrical connection to a processor of a computing system. The extended portion is to redistribute power. The extended portion includes a connection to connect to a power supply unit and a plurality of power connections. The plurality of power connections are located along an edge of the extended portion to connect wiring to other components within the computing system and deliver power from the power supply unit to the other components.

A flexible electronic circuit includes a plurality of leaves having a proximal section, a distal section, and an intermediate section. The plurality of leaves are bonded to each other within the distal section and loose within the intermediate section. The intermediate section also includes conductive connector pads for a wiring harness. A plurality of test connector pads are disposed on the plurality of leaves within the proximal section. The leaves within the proximal section may also be bonded to each other, for example in a ribbon or stepped configuration, in order to facilitate connection to testing apparatus. Once the circuit is tested, the proximal section can be severed from the intermediate section prior to installation of the circuit into a medical device, such as an intracardiac echocardiography catheter.

Disclosed is a printed circuit board having a holder for a battery, wherein the holder includes first and second contacts connected to conductive traces of the printed circuit board and wherein the holder is embodied such that a battery inserted into the holder is clamped so that poles of the battery on opposite end faces of the battery make electrical contact with the first and second contacts. The battery lies clamped between the contacts on a support region of the printed circuit board and is oriented with reference to the printed circuit board so that an imaginary line connecting the poles of the battery is essentially in parallel with the plane of the support region. The printed circuit board has connected with the support region a rigid first section, which is essentially perpendicular to the support region, and wherein the first contact is arranged on the first section.

The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.

A main board for a computer device can include main board components arranged on a first surface of the main board and Trusted Platform Module (TPM) components arranged on the first surface of the main board. The TPM components can be located in a predetermined area of the main board that is detachable from the main board (e.g. by means of a predetermined break line). A method for producing an embodiment of the main board with an integrated TPM can include producing a Printed Circuit Board (PCB); arranging a plurality of main board components in a first area of the PCB; and arranging TPM components in a second area of the PCB that is a detachable predetermined area of the main board. A predetermined breakline which at least partly surronds the predetermined area can be formed by drilling holes to form a perforated line.

A flexible circuit board includes a flexible substrate and a stiffening structure, a stiffening area is defined on a bottom surface of the flexible substrate, and the stiffening structure includes a first stiffener and a second stiffener. The first stiffener is disposed on the stiffening area of the bottom surface and the second stiffener is disposed on the first stiffener such that the first stiffener is located between the flexible substrate and the second stiffener. The flexible substrate is protected from punch damage caused by stress concentrations because a cutting line of the flexible substrate only passes through the first stiffener.