An electronic control unit comprises at least one controller and at least one memory device, wherein the controller comprises at least one electronic component mounted on a main circuit board. An embedded circuit board is formed in one piece with the main circuit board, and a predetermined separation line is provided for separating the embedded circuit board from the main circuit board.

A wiring substrate includes a substrate with a first principal face and a second principal face. The first principal face has a first corner and first and second sides. The second principal face has a second corner corresponding to the first corner, and a third and a fourth side, respectively corresponding to the first and second sides. The substrate further comprising a first side surface connected to the first side, a second side surface connected to the second side, a third side surface connected to the third side, a fourth side surface connected to the fourth side, a first fracture part located between the first and third side surfaces to connect them, and a second fracture part located between the second and the fourth side surfaces to connect them. In the substrate's thickness direction, the length of the second side surface is smaller than the first side surface.

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

An electronic arrangement (100) and a method of manufacturing an electronic arrangement are provided. The electronic arrangement comprises an array of electronic components (110) arranged along a first axis, A, and a carrier (120) arranged to support the array of electronic components, wherein the carrier comprises, a first metal layer (130), a second metal layer (140), and an at least partially insulating layer (150) arranged between the first and second metal layers. The electronic arrangement further comprises a partition portion (160) arranged between two adjacently arranged electronic components for partitioning the electronic arrangement, wherein the second metal layer comprises a void (180) intersected by the second axis, wherein the void has a width (190) which extends parallel to the first axis, such that, at the second axis, the second metal layer is undercut with respect to the first metal layer, in a direction parallel to the first axis.

In one embodiment, a motherboard to be cut, includes: a motherboard body provided, on a surface thereof, with a cutting line comprising a special-shaped cutting line section, wherein, a plurality of positional marker groups are provided on a portion of the surface where the special-shaped cutting line section is provided; each positional marker group includes a first marker assembly and a second marker assembly provided at both sides of the special-shaped cutting line section; and, in the arrangement direction of the first marker assembly and the second marker assembly, size of the first marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the first marker assembly is in, and size of the second marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the second marker assembly is in.

Provided is a method for manufacturing a metal-layer-joined ceramic base material board, in which at least one scribe line is formed, on each of the front and back surfaces of a ceramic base material board, along dividing lines for dividing the ceramic base material board into a plurality of ceramic boards, a metal board covering at least a portion of the dividing lines is joined to each of the front and back surface of the ceramic base material board, the metal boards are etched along the dividing lines to form a plurality of metal layers, and the plurality of metal layers are joined to each of the front and back surfaces of the ceramic base material board.

A board element for board-to-board interconnect formation is provided. An embodiment includes embedding a signal via element in the board element and cutting through respective sections of the board element and the signal via element to expose a new board element edge and an outwardly facing surface of the signal via element.

The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.

The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.