A cover for at least one antenna emitting and/or sensing electromagnetic radiation in at least one first frequency band includes at least one first surface facing the antenna and at least one second surface averted to the antenna, and at least one first carrier layer into which hat least one heating element is embedded, the heating element being connected to a terminal at least partly extending from the first surface and/or being at least partly located on the first surface.

This disclosure describes an electronic component with a package body which comprises a set of sidewalls and a bottom wall. One or more chip mounting elements extend into the space within the package from the inner surface of at least one sidewall, and at least one electronic chip is attached to the chip mounting elements. The electronic component also comprises one or more stiffening elements which extend inside the space within the package from the inner surface of one of the sidewalls to the outer surface of the bottom wall. These stiffening elements are separated from the one or more chip mounting elements inside the enclosed inner space.

The present disclosure relates to a thermally enhanced package, which includes a carrier, a thinned die over the carrier, a mold compound, and a heat extractor. The thinned die includes a device layer over the carrier and a dielectric layer over the device layer. The mold compound resides over the carrier, surrounds the thinned die, and extends beyond a top surface of the thinned die to define an opening within the mold compound and over the thinned die. The top surface of the thinned die is at a bottom of the opening. At least a portion of the heat extractor is inserted into the opening and in thermal contact with the thinned die. Herein the heat extractor is formed of a metal or an alloy.

The invention relates to a motor vehicle component support, in particular a motor vehicle door lock (1), and to a method for the production thereof. Said motor vehicle component support is equipped with a strip conductor structure (3) composed of several strip conductors (7). According to the invention, the strip conductor structure (3) comprises at least two conductor strip sub-structures (3a, 3b) which are electrically interconnected by means of at least one connecting element (8) which is applied later.

A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.

An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.

An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.

A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.

An electronic circuit may include an elastomeric substrate with an electronic die attached to the elastomer substrate at a first substrate area and one or more meander traces electrically coupled to the electronic die and encapsulated in the elastomer substrate at a second substrate area that is adjacent to the first substrate area. An inelastic, non-electronic, structural brace may be attached to the elastomeric substrate in the first substrate area.

The invention deals with a support for light source(s) for a light module, notably for a motor vehicle, comprising a substrate; at least one surface light source of the organic light-emitting diode type supported by the substrate, the at least one surface light source comprising, at one or more edges, at least two electrical contact zones; electrical tracks deposited on the substrate; and electrical contacts between the electrical contact zones of the light source or sources and the electrical tracks. The electrical contacts comprise elastic blades, in contact under pressure with the contact zone or zones of the surface light source or sources and with the electrical tracks on the substrate.