A method of manufacturing an assembly with a housing part and at least two conductors of shape sheet metal parts may include providing at least one first conductor formed from at least one sheet metal part and at least one second conductor formed from at least one sheet metal part. The method may then include arranging the first and second conductors in an injection mould in such a way that the first conductor may come into mechanical contact with the second conductor in a common contact zone to produce an electrical connection. The method may then include at least partially overmoulding the first and second conductors with a plastic to form a joint housing part. The method may further include bonding the first and second conductors in a region of the common contact zone after at least partially overmoulding the first and second conductors.

In an embodiment, a smart connector includes an Application Specific Electronics Packaging (ASEP) device formed by an ASEP manufacturing process, and a separate printed circuit board electrically connected to electrical components of the ASEP device. The ASEP manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of ASEP devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

A manufacturing method of a three-dimensional stretchable electronic device includes: preparing an aluminum mold for producing a substrate having one or more protrusions on an upper side and a lower side thereof; forming a path for a connection line for connecting the protrusions of the substrate using a wire; introducing a first polymer for forming the protrusions of the substrate into a predetermined portion of the aluminum mold; removing the wire and the three-dimensional stretchable substrate from the aluminum mold; injecting a liquid metal into the path for a connection line from which the wire was removed, thus manufacturing a three-dimensional stretchable substrate having a connection line; and transferring elements to the protrusions of the three-dimensional stretchable substrate having the connection line and connecting the elements to the connection line, thus connecting the elements to each other.

A rewiring region is provided in a region other than a pixel region on a front face (pixel formation surface) FA of an imaging element. A mold part is formed around the imaging element other than on the front face FA. Rewiring layers that connect an external terminal and a pad provided in the rewiring region are formed via insulating layers on a side of the pixel formation surface of the imaging element and the mold part. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device is also on the side of the pixel formation surface, and reduction in size and height can be achieved.

A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

Disclosed in the present application are a base with an electronic element and a voice coil motor. The base with an electronic element comprises an electronic element, a metal circuit, a first plastic member, and a second plastic member. The metal circuit is connected to the electronic element and comprises a plurality of branches, a first end of the plurality of branches being connected on a one-to-one basis with pins of the electronic element; the first plastic member is positioned at the connecting position of the metal circuit and the electronic element, and is configured to integrally connect all of the branches of the metal circuit, and limit each branch of the metal circuit; and the second plastic member covers the metal circuit, a second end of the branches of the metal circuit furthest from the electronic element extending out from the second plastic member.

A first resin layer (1) has: a covered region which is covered by a second resin layer (2) and an exposed region (1a); a contact part (1b) which is provided in the exposed region (1a); and a bend part (1c) which is provided between (a) a boundary between the covered region and the exposed region (1a) and (b) the contact part (1b).

A one-surface groove for wiring is formed in a front surface 2a, opposite-surface grooves for wiring are formed in a back surface 2b by protruding core members, and communication parts for allowing the one-surface groove and the opposite-surface grooves to communicate with each other are formed to shape a board section 2 made of a non-conductive resin. After the core members are retracted, a conduction-side resin, which will become conductive, is shaped in the one-surface groove, the opposite-surface grooves, and the communication parts to form front-side wiring 3, communication wirings 4, and back-side wirings 5, whereby a wiring circuit component is provided.

A user interface for an appliance is provided, including a user interface panel and a control component attached to the user interface panel. The user interface panel includes a plurality of traces for providing an electrical connection for the control component. The plurality of traces are integrally formed with the user interface panel such that the plurality of traces and the user interface panel are a single, unitary component. In some embodiments, the unitary user interface panel is curved. A method for forming a unitary user interface of an appliance also is provided, including establishing courses of a plurality of traces of the unitary user interface; converting the courses into control data for use in a laser direct structuring process; and using the laser direct structuring process to integrally form the plurality of traces with a user interface panel to form a unitary user interface panel.