Various embodiments provide a method of manufacturing a high-resolution structure using a size-tunable hydrogel. According to various embodiments, a basic structure may be fabricated. A temporary structure made of a hydrogel may be fabricated by applying a hydrogel to the basic structure. The temporary structure may shrink by dehydrating the hydrogel. This process may be repeated to fabricate smaller structures. The final structure may be fabricated using the temporary structure or the basic structure.

The present invention relates to a thermoplastic resin composition for laser direct structuring process, and a molded product comprising the same. In one specific embodiment, the thermoplastic resin composition comprises: approximately 100 parts by weight of a base resin; approximately 0.1-20 parts by weight of an additive for laser direct structuring; and approximately 1-20 parts by weight of an impact modifier, wherein the base resin comprises a polycarbonate resin, a polycarbonate-polysiloxane copolymer and a polyester resin.

Provided is a circuit board on which a circuit component is mounted on one side, and a recess is formed at a position corresponding to the circuit component on the other side, and the circuit board includes a first heat conductive member that is provided inside the recess and conducts heat generated by the circuit component.

Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.

Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.

A power circuit includes multiple bus bars that are connected to multiple terminals of an FET, are provided flush with each other, and are each insulated from each other. The power circuit includes one bus bar that is connected to drain terminals of the FET, a solder fixing portion of the FET that is arranged on the bus bar, and another bus bar that is connected to source terminals of the FET via a conductive connection sheet.

A wiring substrate at which a metal wire is formed includes a substrate containing a resin as a main component and an organic substance having a hydroxyl group; and a metal plating layer constituting the metal wire. A formation portion of the metal wire at one surface of the substrate is rougher than a non-formation portion of the metal wire at the one surface of the substrate, and has the organic substance in a state of being embedded in the resin, and a catalyst. The wiring substrate with such a configuration can increase the adhesion of the metal wire to the substrate.

Provided are a device and method for molding an FPC and a plastic part, which belongs to the field of FPC processing technology. The method for molding an FPC and a plastic part includes preprocessing a preform and connecting an FPC to the outer cylindrical surface of the preform; and forming a coating on the outer cylindrical surface of the preform by using the device for molding an FPC and a plastic part.