A printed circuit assembly (PCA) for coupling to an IMD feedthrough of an implantable medical device includes a PCB portion and an interposer. The IMD feedthrough has a support structure and a plurality of electrical contacts extending through the support structure. The PCB portion is configured to be arranged relative to the support structure of the IMD feedthrough and includes a plurality of electrical contacts. The interposer is secured to the PCB portion and includes a dielectric over-mold structure and a plurality of leads. Each lead is integrated with the dielectric over-mold structure and includes a weld pad and a solder pad. Each solder pads of the interposer is electrically coupled to a corresponding electrical contacts of the PCB portion to provide an alignment between one or more weld pads of the interposer and one or more corresponding electrical contacts of the IMD feedthrough.

Disclosed are a wound treatment patch using static electricity, and a method for fabricating the wound treatment patch using static electricity. The patch includes a substrate made of a sticky polymer; a first electrode disposed in a first partial region of one face of the substrate and exposed to an outside; and a second electrode disposed in a second partial region other than the first partial region, and spaced apart from the first electrode, and encapsulated within the substrate, wherein each of the first electrode and the second electrode is made of hydrogel having electrical conductivity or a soft polymer having electrical conductivity.

In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third portions of the copper film and ablated sections; electrolytically plating each portion to form metallic-plated portions; and ablating or removing the second portion in order to isolate the first portion. The metallic-plated first portion comprises a circuit portion of a molded interconnect device (MID), and where the metallic-plated third portion comprises a Faraday cage portion of a MID. A soft etching step may be included. A solder resist application step can be added, along with an associated solder resist removal step.

An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.

A patterned conductive article 200 includes a substrate 210 including a unitary layer 210-1 and includes a micropattern of conductive traces 220 embedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234 in direct contact with the unitary layer; and a unitary conductive body 240 disposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewalls 242, 244 and at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.

A silicone rubber-based curable composition of the present invention include a vinyl group-containing organopolysiloxane (A) and silica particles (C), in which a ratio of change in a cut length, in a test piece formed of a cured product of the silicone rubber-based curable composition with the number of times of bending of 50,000, in a case where the test piece is used to perform a De Mattia-type bending resistance test in accordance with JIS K 6260 and the cut length is measured on the basis of a predetermined procedure, is equal to or more than 1.1 and equal to or less than 11.5.

A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate. The method includes applying a first layer of paint to the first layer of the multi-layer circuit. The method includes forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint and electrically coupled to the first layer of the multi-layer circuit. The method includes applying a second layer of paint over the second layer of the multi-layer circuit and forming, by the laser direct structuring process, a third layer of the multi-layer circuit on the second layer of the paint and electrically coupled to the second layer of the multi-layer circuit.

An electrical plug connector (10) having contacts (30) on the input side and a housing (20), within which electrical lines (40) and an electrical switch with at least one sensor device (84) and a control device (82) are connected to the contacts (30). The sensor device (84) and the control device (82) are arranged on a common carrier body (70). The carrier body is formed as a circuit carrier, which is made from plastic by injection-molding, on which metallic conductor tracks (80) are applied. This allows simple integration of sensor and monitoring tasks into conventional plug connectors.

A circuit structure that comprises a substrate and one or more conductive elements disposed on the substrate is provided. The substrate comprises a polymer composition that comprises an electrically conductive filler distributed within a polymer matrix. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.

A rewiring region 22 is provided in a region other than a pixel region 21 on a front face (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the front face FA. Rewiring layers 41b, 42b, and 43b that connect an external terminal and a pad 23 provided in the rewiring region 22 are formed via insulating layers 41a, 42a, and 43a on a side of the pixel formation surface of the imaging element 20 and the mold part 30. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device 10 is also on the side of the pixel formation surface, and reduction in size and height can be achieved.