An electrical connection box includes: a box main body; an electric circuit body loaded into the box main body; a grounding member provided in the electric circuit body; a belt-like grounding metal plate extending from the grounding member to the outside of the box main body; a fixing bracket extending integrally with the box main body and including the grounding metal plate; and a bolt through hole formed through a tip end portion of the fixing bracket to electrically connect the grounding metal plate to a bolt to be inserted.

The description relates to prototyping systems, including hubs for electrically connecting devices. One example can include an electrically insulative substrate and at least two connector tabs defined by the substrate, each connector tab including a data contact, a power contact, and a ground contact positioned over the substrate. A data bus can be positioned relative to the substrate and electrically connect all of the data contacts, a power bus can be positioned relative to the substrate and electrically connect all of the power contacts, and a ground bus can be positioned relative to the substrate and electrically connect all of the ground contacts.

A component carrier with a rigid portion, a flexible portion, a cavity defining the flexible portion next to the rigid portion, and at least one step in a transition portion between the rigid portion and the flexible portion in the cavity is disclosed.

A component carrier includes a plurality of low density layer structures, and a plurality of high density layer structures having a higher density of electrically conductive structures than the plurality of low density layer structures, where the low density layer structures and the high density layer structures are alternatingly vertically stacked.

A method for manufacturing rigid-flexible circuit board includes the step of providing an adhesive sheet defining at least one first opening, a copper foil, and a flexible board. The flexible board comprises a mounting region and a folding region. A removable sheet is pressed on a pressed surface of the adhesive sheet corresponding to each first opening. The copper foil, the adhesive sheet with the removable sheet, and the flexible board are pressed together in that sequence. The removable sheet corresponds to the folding region, and is embedded in the adhesive sheet. The copper foil contacts with the pressed surface and the removable sheet. An interspace is formed between the removable sheet and the flexible board. An outer conductive layer is formed on the copper foil. A removing region of the outer conductive layer corresponding to the folding region and the removable sheet is removed.

In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.

A circuit carrier and a manufacturing method thereof are provided. The circuit carrier for coupling an electronic device includes a flexible structure and a circuit structure. The flexible structure includes a conductive pattern disposed on a surface of a first dielectric layer. The circuit structure includes a second dielectric layer overlying the surface of the first dielectric layer and a circuit layer disposed on the second dielectric layer and connected to the conductive pattern, The flexible structure is embedded in and electrically connected to the circuit structure, and a portion of the flexible structure extends out from an edge of the circuit structure to be plugged into the electronic device.

In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.

A circuit board includes a substrate, an input binding region and at least two output binding regions disposed on the substrate. Each of the output binding regions includes a plurality of binding portions, and the number of the binding portions included in different output binding regions is different. The substrate is configured to output a signal received by the input binding region to respective binding portions included in each of the output binding regions.

A circuit carrier and a manufacturing method thereof are provided. The circuit carrier includes at least one flexible structure and a circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern disposed thereon. The circuit structure is disposed on the flexible structure and electrically connected to the conductive pattern. The circuit structure includes a second dielectric layer and a circuit layer. The second dielectric layer is disposed on the flexible structure and has a Young's modulus different from that of the first dielectric layer. The circuit layer is disposed on and extends into the second dielectric layer to be in contact with the conductive pattern of the flexible structure. The flexible structure is interposed in the circuit structure. A portion of the first dielectric layer and a portion of the conductive pattern of the flexible structure are extended out from an edge of the circuit structure.