A circuit board includes a board body and pair of connection portions disposed at both ends of the board body. Each of the pair of connection portions is inserted into a connector. Each of the pair of connection portions includes a connection terminal electrically connected to the connector, and at least one of the pair of connection portions includes an extending portion extending from the connection terminal to an insertion leading end of the at least one of the pair of connection portion. The extending portion is disposed at a position to avoid a virtual line extending in an insertion direction through a position where the connector and the connection terminal are electrically connected.

A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction; and an external electrode including a base layer including a step portion formed on the main surface, and a plated layer formed on the base layer, the external electrode being connected to the internal electrodes.

A busbar assembly according to the present invention includes a first busbar formed by a conductive metal flat plate; a second busbar formed by a conductive metal flat plate, the second busbar disposed in the same plane as the first busbar with a gap being provided between opposing side surfaces of the first and second busbars; and an insulating resin layer filled in the gap so as to mechanically connect the opposing side surfaces of the first and second busbars. Preferably, the opposing side surface of at least one of the first and second busbars is an inclined surface that is closer to the opposing side surface of the other of the first and second busbars from one side toward the other side in the thickness direction.

According to one embodiment, a flexible substrate includes a flexible insulation base material and a plurality of wiring lines provided on one surface side of the insulation base material, and the insulation base material includes a thinned first area and a second area having a thickness larger than that of the first area, the first area includes a first lower surface, the second area includes a second lower surface, the first lower surface and the second lower surface are formed on an opposite side of a surface on which the wiring lines are provided, and the first lower surface includes an inclined portion inclined towards the second lower surface.

A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.

A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction; and an external electrode including a base layer including a step portion formed on the main surface, and a plated layer formed on the base layer, the external electrode being connected to the internal electrodes.

A coaxial connector includes a base surface; a coaxial structure where a dielectric is between a central conductor and an outer conductor; and a protrusion protruding from the base surface. The central conductor includes a contact portion protruding from the base surface. In response to a substrate being inserted toward the base surface between the contact portion and the protrusion, the contact portion comes into contact with a conductor pattern formed on a surface of the substrate. The outer conductor includes a protruding conductor protruding from the base surface and not in contact with the substrate inserted between the contact portion and the protrusion.

A connector has a casing and a circuit board structure. The circuit board structure is mounted through the casing and has a board main body, a projecting body, and multiple metal electrodes. The projecting body is mounted on a connecting end surface of the board main body and projects from the connecting end surface in an insertion direction of the connector. When the connector is connected to another device, the projecting body of the circuit board structure may push a part of pins of the device first, so the user may exert less force to insert the projecting body into the device. Then, when the circuit board structure is inserted further, the board main body may abut the remaining pins. Because part of the pins have been pushed away by the projecting body, the board main body only needs to counteract resistance from the remaining pins.

A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.

A flexible circuit board is provided. The flexible circuit board includes a first conductive layer, an adhesive layer, and a cover layer. The first conductive layer extends along a first direction. The adhesive layer is disposed on the first conductive layer and has a first side. The cover layer is disposed on the adhesive layer and has a second side. In addition, a bottom of the first side protrudes from a bottom of the second side in the first direction by a distance.