Embodiments disclosed herein include modular electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first connector module having a notch on a first end and a plurality of surface mount technology (SMT) pads on a second end. In an embodiment, the electronics package further comprises a second connector module having a keyed connector on a first end and a plurality of SMT pads on a second end. In an embodiment, the electronics package further comprises a system in package (SIP) module between the first connector module and the second connector module, the component module electrically and mechanically coupled to the SMT pads of the first connector and the SMT pads of the second connector.

A power adapter for powering portable electronic devices is disclosed. The modifications and enhancements to the power adapter can reduce or eliminate the need for adhesives, flexible circuitry, and/or wiring. The power adapter includes multiple guide rails used to guide a circuit board (carrying components) to electrical springs. The electrical springs provide not only an electrical coupling, but also a mechanical coupling. As a result, wiring and/or adhesives is not required. Additionally, a cap is secured to the enclosure through melting part of the cap by, for example, ultrasonic welding without causing damage to the circuit board, as welding location(s) is/are in locations away from the electrical springs and other sensitive components. The power adapter further includes a connector connected to the circuit board. During assembly, the circuit board can pivot in three dimensions during assembly to align the connector with the cap.

A radio frequency (RF) circuit is provided and includes an antenna, a printed circuit board and a RF chip. The printed circuit board includes a stack of layers. The stack of layers includes a grounded layer. The grounded layer includes a slit, a dielectric area, a first grounded area and a second grounded area. The dielectric area includes dielectric material and is disposed between the first grounded area and the second grounded area. The antenna is edge mounted to the ground layer adjacent the dielectric area and offset from a centerline of the ground layer. The second grounded area is disposed between the dielectric area and the slit. The RF chip is mounted to the stack of layers and connected to the antenna via a transmission line and configured to transmit and receive RF signals via the antenna.

A card edge connector with a locking system, which may include a locking member integrally formed with a connector housing. The locking member may deflect upon insertion of an edge of a board into the connector and spring back to engage an opening in the board. The locking member and the opening in the board may have perimeters that are rounded, allowing relative rotation about an axis through the opening even though the board is locked within the connector. Such a configuration may provide a simple and secure locking system. Such a configuration may support connecting two parallel boards, each with a card edge connector, through a riser board with opposite ends inserted into the two connectors. Relative rotation of the board with respect to the connectors enables skew, in a direction parallel to the surfaces of the parallel boards, while securing each of those boards to the riser board.

A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.

A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a first wiring layer including a first electrically conductive trace layout, a second wiring layer including a second electrically conductive trace layout, and a base film interposed between the first and second wiring layers, where the first conductive trace layout includes at least one thermally conductive protective island overlaying a respective portion of the second trace layout to provide a protective thermal barrier to the base film. Hence, maximum temperatures across various layers of the FPC laminate can be reduced, damage to the FPC prevented, and manufacturing yields improved.

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

The present disclosure relates an LCD display module and a mobile terminal, the LCD display module includes: a display screen and a flexible printed circuit led out from a top of the display screen, where the top of the display screen is provided with a recessed portion for accommodating a functional module of a mobile terminal, and the flexible printed circuit is provided with an opening at a position corresponding to the recessed portion.

A connector assembly includes a first signal pin formed to be in contact with a signal line of a circuit board; a first insulator surrounding the first signal pin; and a first housing accommodating the first signal pin and the first insulator and having a hole at a rear thereof corresponding to the first signal pin, wherein the first housing includes at least one clamping arm disposed on at least one side of the hole, protruding to a rear of the first housing, and having a lower surface formed to be in contact with an upper surface of the circuit board and the connector assembly further includes a ground plate disposed below the clamping arm and having an upper surface formed to be in contact with a lower surface of the circuit board; a clamping plate movably disposed below the ground plate; and a fastening member.

Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.