A card edge connector with an improved manner of creating a preload force on conductive elements held by a housing. The housing may include a member and an opening at a mating end. Each conductive element may have a contact portion curving inwardly relative to the opening and a tip extending from the contact portion towards the mating end. Each contact portion may form an electrical connection with an edge pad of a card to be inserted into the opening. The conductive elements may be configured to have a rest state in order to create a proper force to be exerted on the edge pads. The member may preload the conductive elements by contacting the conductive elements from a location farther from the mating end than the contact portion, which may avoid damage upon insertion of a card into the connector without the need for long tips of the conductive elements. As a result, the connector may operate at high frequencies.

Research on practical realization of various types of printable devices has progressed, and the realization of devices in which these printable devices are integrated on a flexible board is expected. However, there is the problem that, if a plurality of printable devices are simply integrated on the same board, the area of the integrated device increases, and the yield ratio greatly decreases. An integration technique that solves the problem of an increase in the area and a decrease in the yield ratio is in demand. Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through-vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.

A memory module card structure includes a main board, a plurality of adhesive layers and a plurality of conduction skirting boards. Two surfaces of the main board respectively are divided into a mounting section and an inserting section. The inserting section is formed with a binding region, and a soldering region having solder pads electrically connected to the mounting section. The conduction skirting boards are correspondingly fixed to the inserting section, and each has a rigid substrate and a plurality of conductive pads. The conductive pad has an outer contacting part disposed on an outer surface of the rigid substrate and an adapting part formed through the rigid substrate and connecting the outer contacting part. A part of the conductive pad correspondingly is soldered to the solder pad. A part of the rigid substrate is fixed connected to the binding region by the adhesive layer.

An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.

A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 m or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.

A semiconductor device mounting board includes a first substrate, a second substrate, a single line, a groove, a feedthrough conductor, and a side conductor. The first substrate includes a mount area and a peripheral area. The second substrate is located in the peripheral area to align with an outer edge of the first substrate and surrounds the mount area. The signal line extends on an upper surface of the second substrate from an inner edge to an outer edge of the second substrate. The groove extends on a side surface of the first substrate from a lower surface to an upper surface of the first substrate. The feedthrough conductor is inside the second substrate and connected to the signal line. The side conductor is on an inner surface of the groove and electrically connected to the feedthrough conductor. The groove is inward from the outer edge of the second substrate.

The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

A memory module card structure includes a main board, a plurality of adhesive layers and a plurality of conduction skirting boards. Two surfaces of the main board respectively are divided into a mounting section and an inserting section. The inserting section is formed with a binding region, and a soldering region having solder pads electrically connected to the mounting section. The conduction skirting boards are correspondingly fixed to the inserting section, and each has a rigid substrate and a plurality of conductive pads. The conductive pad has an outer contacting part disposed on an outer surface of the rigid substrate and an adapting part formed through the rigid substrate and connecting the outer contacting part. A part of the conductive pad correspondingly is soldered to the solder pad. A part of the rigid substrate is fixed connected to the binding region by the adhesive layer.

An electronic module card with bypass capacitor includes a main board, an adhesive layer and a conduction skirting board. The main board has an inserting section and a plurality of solder pads disposed on a soldering region of the inserting section. At least one solder pad has a first extending part extending therefrom. The conduction skirting board is fixed to the inserting section, and has a rigid substrate and a plurality of conductive pads. Each conductive pad has an outer contacting part, and an adapting part. A gap is formed between the conduction skirting board and the main board. At least one conductive pad has a second extending part extended from the adapting part along an inner surface of the rigid substrate. A part of the second extending part is partially overlapped above a part of the first extending part so as to form a bypass capacitor.