Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

A power module assembly structure includes an element layer, a flexible printed circuit board layer, and an external wire layer. The element layer includes one component. The flexible printed circuit board layer includes at least one insulating region and at least one conductive region. The external wire layer is disposed on a second side of the flexible printed circuit board layer. The first side and the second side of the flexible printed circuit board layer are two opposite sides, and the external wire layer includes at least one external wire. The at least one external wire is electrically connected to the at least one conductive region of the flexible printed circuit board layer. The heat generated by the one component is directly conducted to the outside of the power module package structure through the at least one conductive region and the at least one external wire.

A display device includes a first substrate and a flexible circuit board. Data lines, scan lines, thin film transistors, gate contacts, and source contacts are disposed on the first substrate. The scan lines are intersected with the data lines. The thin film transistors are respectively connected to the data lines and the scan lines. The gate contacts are connected to the scan lines. The source contacts are connected to the data lines. The display device further includes first conductive patterns disposed on a side of the first substrate, and the first conductive patterns are connected to at least some of the gate contacts on the side of the first substrate. First pads of the flexible circuit board are connected to the first conductive patterns.

Provided is a multilayer wiring board for inspection of electronic components which has excellent reliability by improving the adhesiveness between a resin wiring portion and a ceramic wiring substrate. A multilayer wiring board 10 according to the present invention includes: a ceramic wiring substrate 20 having a substrate main surface 21 and a substrate rear surface 22; substrate-side conductive layers 32, 33 formed on the substrate main surface 21; and a resin wiring portion 40 stacked on the substrate main surface 21 so as to cover the substrate-side conductive layers 32, 33. Inspection pads 50, 51 for inspection of electronic components are formed on a front surface 49 of the resin wiring portion 40. End surfaces of the substrate-side conductive layers 33 are exposed from side surfaces 13 of the multilayer wiring board 10. An outer peripheral edge of a rear surface of the resin wiring portion 40 is in contact with the surfaces of the substrate-side conductive layers 33, and end surfaces of the resin wiring portion 40 and the end surfaces of the substrate-side conductive layers 33 are positioned closer to the center of the board than end surfaces 23 of the ceramic wiring substrate 20.

A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip. The electrically connecting the integrated circuit chip to the embedded conductor includes flip chip mounting of the integrated circuit chip within the cavity.

A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit hoard to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip.

A connection system has a high-density, high-speed connector that is electrically connected to a plurality of cables by a tiered circuit board. Edges of the circuit board are offset in order to form steps on which conductive pads may be formed. Each set of pads on a given step may be electrically connected to one or more conductors of a cable, such as a twinax ribbon cable. Thus, each of the cables may be coupled to one or more conductive pads on a respective step of the circuit board such that a large number of conductors may be electrically interfaced with the connector in a relatively small space, unencumbered by the bend radius of the cable. In addition, the cables may be coupled to the circuit board in a manner that does not require significant bending at the ends of the cables helping to preserve signal integrity. That is, conductive paths turn at high angles (e.g., close to 90 degrees) within the circuit board rather than at the ends of the cables connected to the circuit board.

A system for transmitting or receiving signals may include a dielectric substrate having a major face, a communication circuit, and an electromagnetic-energy directing assembly. The circuit may include a transducer configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face.

A circuit carrier and a manufacturing method thereof are provided. The circuit carrier includes at least one flexible structure and a circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern disposed thereon. The circuit structure is disposed on the flexible structure and electrically connected to the conductive pattern. The circuit structure includes a second dielectric layer and a circuit layer. The second dielectric layer is disposed on the flexible structure and has a Young's modulus different from that of the first dielectric layer. The circuit layer is disposed on and extends into the second dielectric layer to be in contact with the conductive pattern of the flexible structure. The flexible structure is interposed in the circuit structure. A portion of the first dielectric layer and a portion of the conductive pattern of the flexible structure are extended out from an edge of the circuit structure.

A circuit carrier and a manufacturing method thereof are provided. The circuit carrier includes at least one flexible structure and a circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern disposed thereon. The circuit structure is disposed on the flexible structure and electrically connected to the conductive pattern. The circuit structure includes a second dielectric layer and a circuit layer. The second dielectric layer is disposed on the flexible structure and has a Young's modulus different from that of the first dielectric layer. The circuit layer is disposed on and extends into the second dielectric layer to be in contact with the conductive pattern of the flexible structure. The flexible structure is interposed in the circuit structure. A portion of the first dielectric layer and a portion of the conductive pattern of the flexible structure are extended out from an edge of the circuit structure.