Patent classifications
H05K2201/09218
Asymmetric dual bend skew compensation for reducing differential mode to common mode conversion
In one embodiment, a method includes positioning a first component for generating a differential signal on a printed circuit board, positioning a second component for receiving the differential signal on a printed circuit board, and routing a differential conductor pair on a path between the first component and the second component, wherein the path comprises at least one turn in which the differential conductor pair changes direction. A first conductor and a second conductor of the differential conductor pair each comprise a plurality of sets of bends proximate to the turn to provide skew compensation while reducing differential mode to common mode conversion and wherein each of the sets of bends in the second conductor is aligned with one of the sets of bends in the first conductor.
Differential trace pair system
A differential trace pair system includes a board having a first, a second, a third, and a fourth board structure member. A differential trace pair in the board includes a first differential trace extending between the first and the third board structure members, and a second differential trace extending between the second and the fourth board structure members. The differential trace pair includes a serpentine region that includes a first portion and a second portion where the first and the second differential traces have a first width, are substantially parallel, and spaced apart by a first differential trace pair spacing, and a third portion in which the second differential trace includes a second width that is greater than the first width, the first and second differential traces are substantially parallel and spaced apart by a second differential trace pair spacing that is greater than the first differential trace pair spacing.
DETECTING ELECTROLYTE ON CIRCUIT BOARDS
A battery circuit board includes a substrate, a first trace configured to receive a voltage and forming a first closed loop around a perimeter of the substrate, and a second trace forming a second closed loop around the perimeter of the substrate. The battery circuit board also includes an electrical assembly configured to determine a presence of an electrolyte on the battery circuit board in response to a short circuit between the first closed loop of the first trace and the second closed loop of the second trace.
CIRCUIT BOARD, INDUCTOR, AND RADIO APPARATUS
A power supply circuit board includes a substrate, a first line that is provided on a first main surface of the substrate and that has a land, a second line that is provided on the first main surface of the substrate and that has a land, an inductor that is connected to the land of the first line and the land of the second line and that is made of a ferrite material, and an open stub that is connected to at least one of the first line and the second line.
ELECTRONIC DEVICE INCLUDING EXPANDED FLEXIBLE PRINTED CIRCUIT BOARD ANTENNA MODULE
An electronic device includes a housing configured to form an internal space, a radiating sheet configured to be disposed in the internal space; at least one electronic component configured to be disposed in the internal space and to be in contact with the radiating sheet. An FPCB antenna module configured to be disposed on the radiating sheet includes a conductive pattern and a nonconductive layer configured to surround the conductive pattern, wherein the nonconductive layer may extend on the radiating sheet to a region in which the electronic component is positioned.
TRACE LENGTH ON PRINTED CIRCUIT BOARD (PCB) BASED ON INPUT/OUTPUT (I/O) OPERATING SPEED
A wireline communications system is described. The wireline communications system includes a printed circuit board (PCB). The wireline communications system also includes a system on chip (SoC) die on the PCB. The wireline communications system further includes an external memory device coupled to a memory interface of the SoC die. The external memory device is coupled to the memory interface of the SoC die through a PCB trace. A length of the PCB trace is configured according to an operating speed of the memory interface.
ASYMMETRIC DUAL BEND SKEW COMPENSATION FOR REDUCING DIFFERENTIAL MODE TO COMMON MODE CONVERSION
In one embodiment, a method includes positioning a first component for generating a differential signal on a printed circuit board, positioning a second component for receiving the differential signal on a printed circuit board, and routing a differential conductor pair on a path between the first component and the second component, wherein the path comprises at least one turn in which the differential conductor pair changes direction. A first conductor and a second conductor of the differential conductor pair each comprise a plurality of sets of bends proximate to the turn to provide skew compensation while reducing differential mode to common mode conversion and wherein each of the sets of bends in the second conductor is aligned with one of the sets of bends in the first conductor.
PRINTED CIRCUIT BOARD AND MOTOR INCLUDING THE SAME
A printed circuit board includes a substrate and an inductor, a first through hole defined in the substrate, the inductor including a magnetic core with a middle leg, the middle leg passes through the first through hole, and a conductive trace on at least one conductive layer of the printed circuit board spirally surrounds the first through hole to form conductive coil of the inductor. The present disclosure also provides a motor including a stator, a rotor, and the above described printed circuit board. The inductor is integrated with the printed circuit board, which reduces the size of the board and the motor and reduces material cost and power consumption.
Internal Server Air Quality Station
Air quality inside a computing device is monitored utilizing an air quality monitor that can be sized to simulate a server computing device and can have multiple sensing equipment mounted inside, including equipment to detect corrosive aspects in the air and condensation sensing equipment to detect instances in which condensation can form on computing device hardware. Corrosion sensing can include metallic members that can be electrically coupled to voltage that can induce a current within the metallic members, thereby more accurately simulating the corrosion of operating PCBs. Condensation sensing can include condensation hosting members that can have a thermal mass that is approximately equal to the thermal mass of PCBs and can include heating elements by which the condensation hosting members can more accurately simulate the thermal effects and aspects of operating PCBs, and also moisture detectors, including electrical and optical moisture detectors. Additionally, an off-gassing chamber can be included.
DIFFERENTIAL TRACE PAIR SYSTEM
A differential trace pair system includes a board having a first, a second, a third, and a fourth board structure member. A differential trace pair in the board includes a first differential trace extending between the first and the third board structure members, and a second differential trace extending between the second and the fourth board structure members. The differential trace pair includes a serpentine region that includes a first portion and a second portion where the first and the second differential traces have a first width, are substantially parallel, and spaced apart by a first differential trace pair spacing, and a third portion in which the second differential trace includes a second width that is greater than the first width, the first and second differential traces are substantially parallel and spaced apart by a second differential trace pair spacing that is greater than the first differential trace pair spacing.