A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.

A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.

A printed circuit board includes first and second insulating layers, first and second strip line circuit traces formed on a surface of the first insulating layer, and a patterned dielectric material. The first strip line circuit trace has a first length and carries a first signal. The second strip line circuit trace is adjacent to the first strip line circuit trace, has a second length longer than the first length, and carries a second signal. The patterned dielectric material is provided over a portion of the first length to delay the first signal relative to the second signal. The second insulating layer is affixed to the surface and covers the first and second strip line circuit traces and the patterned dielectric material.

A differential trace pair system includes a board having a first, a second, a third, and a fourth board structure member. A differential trace pair in the board includes a first differential trace extending between the first and the third board structure members, and a second differential trace extending between the second and the fourth board structure members. The differential trace pair includes a serpentine region that includes a first portion and a second portion where the first and the second differential traces have a first width, are substantially parallel, and spaced apart by a first differential trace pair spacing, and a third portion in which the second differential trace includes a second width that is greater than the first width, the first and second differential traces are substantially parallel and spaced apart by a second differential trace pair spacing that is greater than the first differential trace pair spacing.

A terminal, in which terminal conductors are disposed, is preliminarily formed on one surface of a substrate. Electrode conductors including covered lead wires are disposed in a region on the one surface of the substrate that does not overlap the terminal, the electrode conductors being bonded to the substrate by an adhesive material to form a predetermined conductor pattern, whereby a sensor pattern is disposed on the substrate. The lead wires of the electrode conductors are exposed due to the covering being removed at ends of the covered lead wires, the exposed lead wires are disposed while being aligned with and connectable to the corresponding terminal conductors of the terminal. The terminal conductors of the terminal and respective exposed lead wires of the electrode conductors of the sensor pattern are then electrically connected.

An electro-mechanical park lock actuator includes a shaft and a circuit board. The shaft is arranged for connecting to a transmission park pawl. The circuit board includes a first non-contact inductive position sensor integrated circuit, a first trace electrically connected to the first non-contact inductive position sensor integrated circuit for determining an angular position of the shaft, and an electrical connector for connecting the circuit board to an external master controller. In some example embodiments, the electro-mechanical park lock actuator includes an electric motor drivingly connected to the shaft, and a transmission arranged in a torque path between the electric motor and the shaft.

There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an electrically conducting contact structure which extends from the surface into the support structure and is electrically connected to the conductor path at a connection point, thereby forming a common conductor track. The conductor path and the contact structure transition into each other in an enlargement-free manner at the connection point.

Provided are a transparent conductor and a display device including the same, the transparent conductor including: a substrate layer; and a transparent conductive pattern layer formed on the substrate layer, and the transparent conductive pattern layer includes a plurality of conductive areas and non-conductive areas, the non-conductive areas are formed every between neighboring conductive areas, the non-conductive area in the transparent conductive pattern layer has a deviation as calculated by Equation 1 herein, which has a value larger than about 1 and equal to or smaller than about 1.25, and the non-conductive areas have a minimum line width of 40 m or less.

A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 m or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.