An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.

A 3D Electromagnetic Interference (EMI) suppression structure and an electronic device having the same, wherein a coplanar waveguide structure, an isolation layer, and a resonance layer may be installed. Furthermore, under the coplanar waveguide structure, the 3D EMI structure may be installed to connect to a conductor part of the resonance layer through a conductive connection part of the isolation layer, thereby further improving the EMI suppression effect and producing an excellent EMI suppression effect.

A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate.

A network of intermediate device systems may be detachably coupled to an illumination pole electrically connected to a power source. The intermediate device system may comprise a housing with an exterior surface and an interior cavity configured to receive at least one electrical device. The intermediate device system may comprise a control unit communicatively coupled to a processor and configured to receive and process substantially real-time information from at least one of the electronic devices and create a data set based on the received real-time information. The data set may comprise a parameter of the surrounding environment and/or an instruction set configured to operate the at least one electrical devices within the intermediate device system and/or a second intermediate device system within the network. The intermediate device system may also comprise a communication module communicatively coupled to the control unit that forms a bidirectional communication channel to facilitate transfer of the data set between the intermediate device system and a second communication module of the second intermediate device system and receive an incoming data set from the second communication module.

A method of manufacturing a conductive layer on a support body includes a first process of forming a precursor layer containing at least one of metal particles and metal oxide particles on the support body; a second process of forming a sintering layer by irradiating an electromagnetic wave pulse on the precursor layer; and a third process of compressing the sintering layer. The conductive layer is formed by repeating the first to third processes N times, where N denotes a natural number equal to or greater than 2, on the same location of the support body, and the third process performed in the first to (N1)th operations includes forming a surface of the sintering layer in an uneven shape.

A wiring board includes a first insulation layer comprising first and second surfaces; a second insulation layer located at an outermost layer on the first surface; a third insulation layer located at an outermost layer on the second surface; a first mounting region located on an outermost surface on the first surface; a second mounting region located on the outermost surface on the first surface and surrounding the first mounting region; a plane conductor located on the third insulation layer; and a solder resist covering the third insulation layer and the plane conductor and having an opening that exposes part of the plane conductor. In plane perspective, in a frame-shaped region between outer peripheral edges of the first and second mounting regions, the plane conductor comprises clearances at point-symmetric positions taking a center of the opening as a point of symmetry.

The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

Techniques for reducing multi-reflection noise via compensation structures are described herein. An example system includes a capacitive component. The example system further includes a capacitive compensation structure coupled to two ends of the capacitive component. The example system includes a partially meshed ground plane coupled to one side of a dielectric substrate. The example system also includes one or more signal conductors coupled to another side of the dielectric substrate and electrically coupled to the capacitive component. The one or more signal conductors are located parallel to a meshed length of the partially meshed ground plane.

[Object] Provided is a printed circuit board ensuring a degree of freedom in circuit design and unlikely to cause a circuit connection failure. [Solving Means] A middle interlayer circuit 11, an upper surface side interlayer circuit 12, and a lower surface side interlayer circuit 13 are formed from a connection surface-less integral conductor. In addition, a connection surface 33 between the upper surface side interlayer circuit 12 and an upper surface side surface layer circuit 14 and a connection surface 34 between the lower surface side interlayer circuit 13 and a lower surface side surface layer circuit 15 lack a connection surface in a plate thickness direction, and thus a satisfactory connection state is achieved. Accordingly, a first circuit 10 is unlikely to cause a connection failure. In addition, the upper surface side interlayer circuit 12 and the lower surface side interlayer circuit 13 can be disposed at misaligned positions in the plane direction of the printed circuit board, and thus the degree of freedom in circuit design increases. Plane circuits 24 and 16 not connected to the first circuit can be disposed with insulating layers 31 and 32 sandwiched below the upper surface side interlayer circuit 12 or above the lower surface side interlayer circuit 13.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure/s within urban settings, each configured to operate by a processor/controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data/instruction/s processing the inputs with resident code parameters generating outputs that are configured to mitigate/avert intermittent environmental events harmful/hazardous to humans.