An axial field rotary energy device has a PCB stator panel assembly between rotors with an axis of rotation. Each rotor has a magnet. The PCB stator panel assembly includes PCB panels. Each PCB panel can have layers, and each layer can have conductive coils. The PCB stator panel assembly can have a thermally conductive layer that extends from an inner diameter portion to an outer diameter portion thereof.

Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body (10) of a circuit board includes a hole (12) enclosed by a conductive layer in the main body (10), the conductive layer constitutes a wall (11) of the hole (12), and a dielectric filling layer (13), which has a dielectric constant smaller than that of the main body (10), is disposed between at least a portion of the wall (11) of the hole (12) and the main body (10), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.

A printed circuit board has a double-sided substrate with an insulation layer, a bonding member, a base layer of an aluminum material, and a circuit pattern; a second insulation layer; a second bonding member; a second base layer; a through hole; a zinc substitution layer; a plating layer; and a second circuit pattern.

Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.

A selective segment via plating process for manufacturing a circuit board selectively interconnects inner conductive layers as separate segments within the same via. Plating resist is plugged into an inner core through hole and then stripped off after an electroless plating process. Stripping of the electroless plating on the plating resist results in a plating discontinuity on the via wall. In a subsequent electroplating process, the inner core layer can not be plated due to the plating discontinuity. The resulting circuit board structure has separate electrically interconnected segments within the via.

A circuit board, a preparation method thereof, and an electronic device are provided. The circuit board includes: a substrate, defining a first through-hole; a metal block, embedded in the first through-hole and fixedly connected to the substrate; a conductive line layer, arranged on at least one side surface of the substrate; wherein the conductive line layer partially covers an opening of the first through-hole on a corresponding side surface of the substrate; and a conductive channel, penetrating the conductive line layer and the metal block in turn. The conductive channel comprises a second through-hole and a conductive medium plated on a wall of the second through-hole; an end of the conductive medium is connected to the conductive line layer, and another end of the conductive medium is connected to the metal block.

Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body (10) of a circuit board includes a hole (12) enclosed by a conductive layer in the main body (10), the conductive layer constitutes a wall (11) of the hole (12), and a dielectric filling layer (13), which has a dielectric constant smaller than that of the main body (10), is disposed between at least a portion of the wall (11) of the hole (12) and the main body (10), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.

Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.

A rewiring region 22 is provided in a region other than a pixel region 21 on a front face (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the front face FA. Rewiring layers 41b, 42b, and 43b that connect an external terminal and a pad 23 provided in the rewiring region 22 are formed via insulating layers 41a, 42a, and 43a on a side of the pixel formation surface of the imaging element 20 and the mold part 30. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device 10 is also on the side of the pixel formation surface, and reduction in size and height can be achieved.