A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.

A circuit structure includes a first busbar, a second busbar, an insulating member including an insulating portion located between the first busbar and the second busbar, a first wiring board provided on one main surface of the first busbar, one main surface of the second busbar and the insulating portion, and a first electronic component provided on the first wiring board. The first electronic component has a first connection terminal electrically connected to the first busbar and bonded to the first wiring board, and a second connection terminal electrically connected to the second busbar and bonded to the first wiring board.

Embodiments include a package substrate, a method of forming the package substrate, and a semiconductor package. A package substrate includes a conductive layer in a dielectric, a first trace and a first via pad of the conductive layer having a first thickness, and a second trace and a second via pad of the conductive layer having a second thickness. The second thickness of second trace and second via pad may be greater than the first thickness of the first trace and first via pad. The dielectric may include a first dielectric thickness and a second dielectric thickness, where the second dielectric thickness may be less than the first dielectric thickness. The package substrate may include a third via having a third thickness on the first via pad, and a fourth via having a fourth thickness on the second via pad, wherein the third thickness is greater than the fourth thickness.

A circuit board, a preparation method thereof, and an electronic device are provided. The circuit board includes: a substrate, defining a first through-hole; a metal block, embedded in the first through-hole and fixedly connected to the substrate; a conductive line layer, arranged on at least one side surface of the substrate; wherein the conductive line layer partially covers an opening of the first through-hole on a corresponding side surface of the substrate; and a conductive channel, penetrating the conductive line layer and the metal block in turn. The conductive channel comprises a second through-hole and a conductive medium plated on a wall of the second through-hole; an end of the conductive medium is connected to the conductive line layer, and another end of the conductive medium is connected to the metal block.

The present disclosure provides a multilayer wiring structure, including a plurality of dielectric layers, a plurality of conductive wiring layers interleaved with the plurality of dielectric layers, wherein the plurality of conductive wiring layers includes copper-phosphorous alloys (such as Cu.sub.3P).

A multilayer substrate includes layers stacked on each other in an up-down direction of a multilayer body. The layers include a first spacer, a first ground conductive layer above the first spacer, and a signal conductive layer that overlaps the first ground conductive layer and is located below the first spacer. First through-holes pass through the first spacer and are arranged along a first direction. A distance between centroids of first through-holes adjacent to each other in the first direction is uniform or substantially uniform. Sets of first through-holes are provided in the first spacer. Sets of first through-holes are arranged along a second direction. A distance between centroids of first through-holes adjacent to each other in the second direction is uniform or substantially uniform. At least one first through-hole is a first hollow through-hole overlapping the signal conductive layer.

A conductive glass substrate, and a system and a method for manufacturing the same are provided. The conductive glass substrate includes a glass substrate structure, a conductive base structure and a conductive extending structure. The glass substrate structure includes at least one through hole connected between a bottom surface and a top surface thereof. The conductive base structure is disposed on the bottom surface of the glass substrate structure. The conductive extending structure is electrically connected to the conductive base structure, and the conductive extending structure is extended from the conductive base structure to the top surface of the glass substrate structure along an inner surface of the at least one through hole. Hence, the conductive glass substrate can provide at least one conductive via so as to electrically connect an upper circuit and a lower circuit.

Provided is an example of a technology capable of accurately controlling impedance.

Provided is a substrate including a first through hole that penetrates a substrate from a first face to a second face of the substrate, and is electrically connected to a transmission line through which a signal is transmitted, a second through hole that is provided adjacent to the first through hole in plan view of the substrate, penetrates the substrate from the first face to the second face, and is electrically connected to a ground, and an adjustment unit that adjusts a distance between the first through hole and the second through hole in plan view of the substrate to adjust an impedance of a connection end of the first through hole with the transmission line.

A printed circuit board includes a printed circuit board includes a substrate portion having a recess portion and including a first circuit layer, abridge disposed in the recess portion and including an insulating layer and a bridge circuit layer, an insulating material disposed in at least a portion of the recess portion and covering at least a portion of the bridge, a second circuit layer disposed on the insulating material, and a first via penetrating through the insulating material and a portion of the bridge and connecting the second circuit layer and the bridge circuit layer to each other.

An axial field rotary energy device can include rotors having magnets and an axis of rotation. A stator assembly can be located axially between the rotors. The stator assembly can include PCB panels. Each PCB panel can have layers. Each layer can include coils. Each coil can have radial traces relative to the axis. The radial traces can include non-linear radial traces coupled by arch traces that are transverse to the non-linear radial traces.