A wiring substrate device includes a wiring substrate, a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end, and a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.

A circuit board includes vias with a coil structure. A circuit board includes vias with barrels that extend vertically through the circuit board and pads in different planes of the circuit board, such as the top surface and bottom surface, and optionally in an inner routing layer. The coil structure is a coil of conductor in a plane of the circuit board, electrically connected to a pad in that plane, which is electrically connected to the barrel. The coil structure provides self-inductance around the pad, which brings up the reactive impedance of the via to balance the capacitive reactance of the via.

A rewiring region 22 is provided in a region other than a pixel region 21 on a front face (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the front face FA. Rewiring layers 41b, 42b, and 43b that connect an external terminal and a pad 23 provided in the rewiring region 22 are formed via insulating layers 41a, 42a, and 43a on a side of the pixel formation surface of the imaging element 20 and the mold part 30. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device 10 is also on the side of the pixel formation surface, and reduction in size and height can be achieved.

Embodiments include a package substrate, a method of forming the package substrate, and a semiconductor package. A package substrate includes a conductive layer in a dielectric, a first trace and a first via pad of the conductive layer having a first thickness, and a second trace and a second via pad of the conductive layer having a second thickness. The second thickness of second trace and second via pad may be greater than the first thickness of the first trace and first via pad. The dielectric may include a first dielectric thickness and a second dielectric thickness, where the second dielectric thickness may be less than the first dielectric thickness. The package substrate may include a third via having a third thickness on the first via pad, and a fourth via having a fourth thickness on the second via pad, wherein the third thickness is greater than the fourth thickness.

A package for an optical module includes a substrate that includes a first wiring layer, a second wiring layer, and a third wiring layer. The package includes a first insulating layer between the first wiring layer and the second wiring layer, the first insulating layer including first vias. The package includes a second insulating layer between the second wiring layer and the third wiring layer, the second insulating layer including second vias and third vias. Each first vias is provided between a corresponding second via and a corresponding third via. The first vias are arranged at a first interval along a first direction. The second vias are arranged at a second interval along the first direction. Each second vias is disposed at an offset by half of the second interval from the corresponding third via.

An axial field rotary energy device has a PCB stator panel assembly between rotors with an axis of rotation. Each rotor has a magnet. The PCB stator panel assembly includes PCB panels. Each PCB panel can have layers, and each layer can have conductive coils. The PCB stator panel assembly can have a thermally conductive layer that extends from an inner diameter portion to an outer diameter portion thereof.

The invention relates to a method for manufacturing (S) an electronic board (1) comprising the following steps: forming (S1, S4) a cavity (20) in the conductive skin layer (C.sub.1) and in an underlying insulating layer (10), so that at least part of a solder pad (4) is exposed, filling (S5) the cavity (20) with a solder paste (24), placing (S6) an SMD (3) opposite the cavity (20), soldering the SMD (3) on the electronic board (1).

A method for preparing a PCB product having highly dense conductors, the method including providing a PCB substrate including a conductive layer, employing an inkjet printer to selectively print unexposed photosensitive patterns on the PCB substrate, the unexposed photosensitive patterns having a thickness of less than 5 pm, exposing the photosensitive patterns to radiation thereby to define exposed patterns, the exposed patterns having a pitch less than 20 pm and wet etching the conductive layer in accordance with a pattern defined by the exposed patterns thereby to define the highly dense conductors having a pitch of less than 30 pm.

A printed wiring board includes a conductor layer, an outermost resin insulating layer having a first surface and a second surface on the opposite side with respect to the first surface and laminated on the conductor layer such that the second surface faces the conductor layer, and metal posts formed in the outermost resin insulating layer such that the metal posts are penetrating through the outermost resin insulating layer and reaching the conductor layer. The metal posts include first metal posts and second metal posts such that each of the first metal posts has a first upper surface positioned above the first surface of the outermost resin insulating layer and having an entirely flat surface and that each of the second metal posts has a second upper surface positioned above the first surface of the outermost resin insulating layer and having a partly flat surface.

An axial field rotary energy device with a PCB stator having interleaved PCBs is disclosed. The device can include rotors that have magnets and an axis of rotation. A stator assembly can be located axially between the rotors to operate electrical phases. The stator assembly can include PCB panels. Each PCB panel can have layers, and each PCB panel can be designated to one of the electrical phases. Each electrical phase of the stator assembly can be provided by a plurality of the PCB panels. In addition, the PCB panels for each electrical phase can be axially spaced apart from and intermingled with each other.